Endicott Interconnect Technologies today announced a $10 Million capital expansion program to meet robust demand in all of its products. "Endicott Interconnect's printed circuit board, semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," says Jim Herard, Marketing Manager for Endicott Interconnect.
The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
"I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.
