The United States Display Consortium (USDC) announced today that it had awarded a contract for the creation of a Center for Advanced Microelectronics Manufacturing (CAMM) to a team consisting of Binghamton University, Cornell University and Endicott Interconnect Technologies.
The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center.
The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center.
The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.
Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."
