Garden Grove, CA -- Dave Howard, Vice President and COO for Burkle North America's FabFour Group, announced today that Endicott Interconnect Technologies has placed an order for another four (4) MX-1 XXL advanced high speed drilling machines from Schmoll Maschinen (Germany). They have again chosen a mix of single station single head machines and also single station dual head machines (one drilling and one routing) with the added option of vision. EI now has a total of 8 units from Schmoll.
Schmoll, located near Frankfurt, Germany is part of Burkle's FabFour Machinery Alliance consisting of Burkle Lamination and Coating Systems, Posalux high volume drilling and routing systems, Bacher Registration and Exposure Systems and LHMT Scoring and Beveling equipment.
For more information, contact Dave Howard, at 714-379-5090, or visit Burkle North America's Web Site at www.burkleusa.com.
Monday, November 12, 2007
Tuesday, October 30, 2007
Endicott Interconnect Technologies' Wire Bond Product Launched into Space
Endicott, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.
EI assisted Northrop Grumman's Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.
“The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,” explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI's wire bond PBGA organic materials packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.
About Northrop Grumman Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide. www.st.northropgrumman.com.
The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.
EI assisted Northrop Grumman's Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.
“The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,” explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI's wire bond PBGA organic materials packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.
About Northrop Grumman Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide. www.st.northropgrumman.com.
Tuesday, October 23, 2007
Endicott Interconnect's SiP Designs Reduce PWB Size, Weight, Complexity and Cost
Endicott, NY -- System in Package (SiP) designs from Endicott Interconnect (EI) Technologies reduce size and weight, sweep multiple packages from a printed wiring board (PWB) into a SiP for improved electrical performance, and reduce PWB complexity and cost. The result is a significant “shrink” in package size and an enormous expansion in performance per sq. in. of PC board real estate.
EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and combining the Company’s extensive experience in thermal solutions with EI’s PTFE-based HyperBGA® or CoreEZ™ organic semiconductor packages featuring thin core build-up flip chip technology. These semiconductor packaging solutions offer exceptional electrical performance, wireability and reliability.
For example, a 7.75” x 15” PCB can be re-designed to a 2.2” x 2.2” size using a 3-4-3 CoreEZ™ substrate with 4 signals, 6 planes and 30 micron lw/ls; and an assembly that includes 5 flip chip FPGAs, CSP memory, passive components, SMT components, PGA connector and 2-sided assembly.
Another SiP conversion using reduced package size components and CoreEZ™ technology condensed a single board computer (SBC) design from 25 sq. in. to 9 sq. in. Also, with extremely thin SiP package on a CoreEZ™ 2-6-2 substrate with buried passives, EI’s SiP designs are not physically limited to a square or rectangular shape, should the application call for something “out of the box”.
Substrate design integration at system level is the key, according to EI, to achieving substantial reduction in PWB design complexity and cost. Elements include:
• Organic substrates for significant weight reduction (thin PTFE substrates are typically 1/10 the weight of a comparable ceramic substrate)
• Thin substrates for significant electrical performance improvements
• SiP designs for shorter signal paths
• Pinned or BGA PWB interface
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and combining the Company’s extensive experience in thermal solutions with EI’s PTFE-based HyperBGA® or CoreEZ™ organic semiconductor packages featuring thin core build-up flip chip technology. These semiconductor packaging solutions offer exceptional electrical performance, wireability and reliability.
For example, a 7.75” x 15” PCB can be re-designed to a 2.2” x 2.2” size using a 3-4-3 CoreEZ™ substrate with 4 signals, 6 planes and 30 micron lw/ls; and an assembly that includes 5 flip chip FPGAs, CSP memory, passive components, SMT components, PGA connector and 2-sided assembly.
Another SiP conversion using reduced package size components and CoreEZ™ technology condensed a single board computer (SBC) design from 25 sq. in. to 9 sq. in. Also, with extremely thin SiP package on a CoreEZ™ 2-6-2 substrate with buried passives, EI’s SiP designs are not physically limited to a square or rectangular shape, should the application call for something “out of the box”.
Substrate design integration at system level is the key, according to EI, to achieving substantial reduction in PWB design complexity and cost. Elements include:
• Organic substrates for significant weight reduction (thin PTFE substrates are typically 1/10 the weight of a comparable ceramic substrate)
• Thin substrates for significant electrical performance improvements
• SiP designs for shorter signal paths
• Pinned or BGA PWB interface
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
Monday, October 1, 2007
IPC Honors 15 Member Companies with IPC Founders Awards Proving There Is Life After 40
BANNOCKBURN, Ill., ― Association Connecting Electronics Industries® presented 15 member companies with the first-ever IPC Founders Awards for their continuous site memberships of 40 or more years. The companies were recognized during a 50th Anniversary Luncheon at the IPC Midwest Conference & Exhibition on September 26, 2007.
Award recipient companies represented a cross section of original equipment manufacturers (OEMs), suppliers and printed board companies located in North America, Asia and Europe. IPC Founders Awards were presented to:
Ruwel AG. (Geldern, Germany; 40 years) Rohm and Haas (Freeport, N.Y.; 40 years) Yamanashi Avionics Co. (Yamanashi, Japan; 40 years) BGF Industries Inc. (Greensboro, N.C.; 41 years) The Boeing Company (Seattle, Wash.; 41 years) Hexcel (Anderson, S.C.; 41 years) Rockwell Collins (Cedar Rapids, Iowa; 42 years) Sypris Electronics LLC (Tampa, Fla.; 42 years) E.I. du Pont de Nemours and Co. (Circleville, Ohio; 43 years) Harris Corporation (Melbourne, Fla.; 43 years) Honeywell Corporation (Clearwater, Fla.; 43 years) Rogers Corporation (Rogers, Conn.; 43 years) Isola Group SARL (Chandler, Ariz; 47 years) Endicott Interconnect Technologies (Endicott, N.Y.; 48 years) Lockheed Martin Corporation (Oswego, N.Y.; 48 years)
“Over the years, these companies have experienced significant changes ― evolving with their dynamic industry, and in many cases, with new leadership and new names. The fact that these companies are still here today is a testament to their successes in managing, innovating, and serving, first as pioneers and now as leaders,” praised Denny McGuirk, president of IPC. “It has certainly been IPC’s privilege to serve them over these many years, and to work with them in strengthening our industry. These companies continue to pave the way for innovation and IPC salutes them.”
Accepting the award on behalf of Rockwell Collins, Wayne Flory, senior director, Advanced Operations and Services said, “Rockwell Collins has enjoyed a truly collaborative relationship with IPC and its members for the past 42 years. The ability to work with industry experts on a global scale allows us to jointly solve problems more quickly and to apply standards which benefit our company and the entire industry. We are pleased to help celebrate the many achievements of IPC over the past 50 years because we realize many of our own accomplishments have been made possible through the relationships developed here.”
For additional information on the IPC Founders Awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Award recipient companies represented a cross section of original equipment manufacturers (OEMs), suppliers and printed board companies located in North America, Asia and Europe. IPC Founders Awards were presented to:
Ruwel AG. (Geldern, Germany; 40 years) Rohm and Haas (Freeport, N.Y.; 40 years) Yamanashi Avionics Co. (Yamanashi, Japan; 40 years) BGF Industries Inc. (Greensboro, N.C.; 41 years) The Boeing Company (Seattle, Wash.; 41 years) Hexcel (Anderson, S.C.; 41 years) Rockwell Collins (Cedar Rapids, Iowa; 42 years) Sypris Electronics LLC (Tampa, Fla.; 42 years) E.I. du Pont de Nemours and Co. (Circleville, Ohio; 43 years) Harris Corporation (Melbourne, Fla.; 43 years) Honeywell Corporation (Clearwater, Fla.; 43 years) Rogers Corporation (Rogers, Conn.; 43 years) Isola Group SARL (Chandler, Ariz; 47 years) Endicott Interconnect Technologies (Endicott, N.Y.; 48 years) Lockheed Martin Corporation (Oswego, N.Y.; 48 years)
“Over the years, these companies have experienced significant changes ― evolving with their dynamic industry, and in many cases, with new leadership and new names. The fact that these companies are still here today is a testament to their successes in managing, innovating, and serving, first as pioneers and now as leaders,” praised Denny McGuirk, president of IPC. “It has certainly been IPC’s privilege to serve them over these many years, and to work with them in strengthening our industry. These companies continue to pave the way for innovation and IPC salutes them.”
Accepting the award on behalf of Rockwell Collins, Wayne Flory, senior director, Advanced Operations and Services said, “Rockwell Collins has enjoyed a truly collaborative relationship with IPC and its members for the past 42 years. The ability to work with industry experts on a global scale allows us to jointly solve problems more quickly and to apply standards which benefit our company and the entire industry. We are pleased to help celebrate the many achievements of IPC over the past 50 years because we realize many of our own accomplishments have been made possible through the relationships developed here.”
For additional information on the IPC Founders Awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Thursday, September 27, 2007
PCB Assemblies for High Volume Commercial Applications from Endicott Interconnect Technologies
ENDICOTT, NY -- PC board assembly specialist Endicott Interconnect (EI) Technologies now offers high-volume, low-cost, fully assembled PC boards via EI Shenzhen, its new 40,000 sq. ft. facility in China.
“Customers will continue to receive technical support through EI Endicott for new product development and introduction, but once volume production ramps up for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, Product Manager of EI Complex Assembly Operations. PCBs can be assembled in the high volumes necessary to meet customer requirements and EI is committed to adding incremental capacity as needed.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 18” x 24” (457 mm x 610 mm) for SMT or non-SMT backplanes.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03” (0.8 mm ) pitch, and PBGA), fine pitch leaded parts to 12 mils, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis, system assemblies – can be provided.
Products for which EI Shenzhen can provide low-cost, high volume production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
Once product design & development is complete and volume production is ready to begin, order placement, tracking and invoicing is all done at EI Endicott, with documentation and configuration management controlled by EI Endicott.
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
“Customers will continue to receive technical support through EI Endicott for new product development and introduction, but once volume production ramps up for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, Product Manager of EI Complex Assembly Operations. PCBs can be assembled in the high volumes necessary to meet customer requirements and EI is committed to adding incremental capacity as needed.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 18” x 24” (457 mm x 610 mm) for SMT or non-SMT backplanes.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03” (0.8 mm ) pitch, and PBGA), fine pitch leaded parts to 12 mils, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis, system assemblies – can be provided.
Products for which EI Shenzhen can provide low-cost, high volume production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
Once product design & development is complete and volume production is ready to begin, order placement, tracking and invoicing is all done at EI Endicott, with documentation and configuration management controlled by EI Endicott.
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
Tuesday, September 11, 2007
2007 College Scholarships Awarded by Endicott Interconnect Technologies, Inc.
ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) held a luncheon to honor the winners of the 2007 College Scholarship Program. Winners this year include: Daniel Longo, son of Mike and Karen Longo; Mark Poliks, son of Mark and Barbara Poliks; Konstantina Papathomas, daughter of Kostas and Athena Papathomas; Maxx Lucas, son of Brian and Maureen Lucas; and Peter Lo, son of Albert & Lizer Lo.
Winners of the $1,000 award were chosen from a very competitive field based upon their academic standing and service to the community. Applicants, who must be dependents of Endicott Interconnect, Huron Real Estate or Surescan Corp., submitted two essays, a school transcript and a listing of extra curricular activities with primary consideration being given to students pursuing engineering, business and computer science degrees. Submissions were evaluated by a panel of judges made up of Endicott Interconnect, Huron Real Estate and SureScan Corp. employees.
“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.
Winners of the $1,000 award were chosen from a very competitive field based upon their academic standing and service to the community. Applicants, who must be dependents of Endicott Interconnect, Huron Real Estate or Surescan Corp., submitted two essays, a school transcript and a listing of extra curricular activities with primary consideration being given to students pursuing engineering, business and computer science degrees. Submissions were evaluated by a panel of judges made up of Endicott Interconnect, Huron Real Estate and SureScan Corp. employees.
“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.
Thursday, August 23, 2007
Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract
ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) announced today that it has been awarded an initial, multi-year production contract to supply printed circuit boards to Raytheon Company’s Space and Airborne Systems. The boards are used in the Common Integrated Processor (CIP) of the F-22 Raptor.
The F-22 Raptor, utilizing stealth technology, was originally envisioned as an air superiority fighter, but is also equipped for ground attack, electronic warfare and signals intelligence roles. The CIP is the “brains” of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.
After extensive review of technologies and manufacturing capabilities, EI was selected by Raytheon’s McKinney, TX and El Segundo, CA locations. “Our continued progression of yield improvement for these products made complex by the need for dual metallurgy and the stringent requirements surrounding this specification coupled with our meeting the performance and reliability demands led to our win of this program,” stated Eric Hills, Director of Military and Defense Programs at EI.
“This is a significant win because it represents our first contract for production in the aerospace and defense segment for Raytheon. From our initial engagements, we have made the commitment to deliver unparalleled customer service and technical support providing the quality and manufacturability Raytheon requires for its products,” commented EI President and CEO, James J. McNamara. “I’m very proud of the EI team for contributing to Raytheon’s success and it’s our intention to continue doing so for many years to come.”
About Raytheon Company’s Space and Airborne Systems Space and Airborne Systems business is a $3 billion world leader in the design, development and manufacture of advanced electronic systems for precision engagement; missile defense; and intelligence, surveillance and reconnaissance applications. Key capabilities include electro-optical/infrared sensors, airborne radars, solid state high energy lasers, precision guidance systems, electronic warfare systems and space-qualified systems for civil and military applications. Headquartered in El Segundo, CA, Space and Airborne Systems has 11,000 employees and additional facilities in Goleta, CA; Forest, MS; Dallas, McKinney and Plano, TX; and several international locations.
The F-22 Raptor, utilizing stealth technology, was originally envisioned as an air superiority fighter, but is also equipped for ground attack, electronic warfare and signals intelligence roles. The CIP is the “brains” of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.
After extensive review of technologies and manufacturing capabilities, EI was selected by Raytheon’s McKinney, TX and El Segundo, CA locations. “Our continued progression of yield improvement for these products made complex by the need for dual metallurgy and the stringent requirements surrounding this specification coupled with our meeting the performance and reliability demands led to our win of this program,” stated Eric Hills, Director of Military and Defense Programs at EI.
“This is a significant win because it represents our first contract for production in the aerospace and defense segment for Raytheon. From our initial engagements, we have made the commitment to deliver unparalleled customer service and technical support providing the quality and manufacturability Raytheon requires for its products,” commented EI President and CEO, James J. McNamara. “I’m very proud of the EI team for contributing to Raytheon’s success and it’s our intention to continue doing so for many years to come.”
About Raytheon Company’s Space and Airborne Systems Space and Airborne Systems business is a $3 billion world leader in the design, development and manufacture of advanced electronic systems for precision engagement; missile defense; and intelligence, surveillance and reconnaissance applications. Key capabilities include electro-optical/infrared sensors, airborne radars, solid state high energy lasers, precision guidance systems, electronic warfare systems and space-qualified systems for civil and military applications. Headquartered in El Segundo, CA, Space and Airborne Systems has 11,000 employees and additional facilities in Goleta, CA; Forest, MS; Dallas, McKinney and Plano, TX; and several international locations.
Tuesday, August 21, 2007
Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification
ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.
The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.
“This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.
“This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
Thursday, July 12, 2007
Endicott Interconnect Technologies, Inc. Offers PCB Assembly Capability for High Volume Commercial Applications in Shenzhen, China
Endicott Interconnect Technologies, Inc. (EI) announced today that they have conditionally qualified their assembly operation for high volume commercial applications located in China and are currently ramping for full production. The Company has leased 40,000 sq. ft. of production space from Lorom Industrial Co. in its Shenzhen facility and installed production equipment to support this operation.
EI will provide all materials, technical know-how and training, including work instructions, documentation and engineering support to ensure successful production start up. Lorom will be responsible for facility maintenance, production staff and general support per EI’s specifications and requirements. EI will maintain control of the design, new product introduction activity, specifications, quality requirements, sales and technical support worldwide for the products.
“I am looking forward to a mutually beneficial partnership with Lorom. Their world-class manufacturing facilities and skilled workforce along with their continual focus on achieving the highest quality products and value-added solutions at competitive prices will greatly benefit our customers worldwide,” commented James J. McNamara Jr., President and CEO of EI.
“This agreement complements EI’s long-term manufacturing strategy of delivering high quality, cost effective products to our global customer base. By expanding our assembly offering we are able to provide a total solution, including technical support from our Endicott facility during the new product introduction phase and cost effective, high volume production capability in China,” added Wade Phelan, VP and GM, Complex Assembly Division for EI.
“EI’s success is admirable. After many constructive meetings with mutual trust and respect, we applaud EI for choosing to partner with Lorom in this effort. This union makes our Lorom, Shenzhen plant more valuable than ever. This agreement also offers our employees the opportunity to work with one of the preeminent manufacturing companies while delivering our customers a broad range of high quality products at competitive prices. I strongly believe this partnership will strengthen our high-tech manufacturing development and bring prosperity through a substantial increase in global market share to both companies,” stated YT Yuan, President and CEO of Lorom Industrial Co., LTD.
About Lorom Industrial Co., LTD.
Lorom, established in 1988, is a vertically integrated, global provider for manufacturing and development of PCB assembly, bulk cables and assemblies, power and fiber patch cords, wire harnesses, adapters and terminators and value added solutions. Headquartered in Taipei, Taiwan, Lorom has a worldwide sales presence and state-of-the-art manufacturing capability in Taiwan and mainland China. For more information about Lorom, please visit www.lorom.com
EI will provide all materials, technical know-how and training, including work instructions, documentation and engineering support to ensure successful production start up. Lorom will be responsible for facility maintenance, production staff and general support per EI’s specifications and requirements. EI will maintain control of the design, new product introduction activity, specifications, quality requirements, sales and technical support worldwide for the products.
“I am looking forward to a mutually beneficial partnership with Lorom. Their world-class manufacturing facilities and skilled workforce along with their continual focus on achieving the highest quality products and value-added solutions at competitive prices will greatly benefit our customers worldwide,” commented James J. McNamara Jr., President and CEO of EI.
“This agreement complements EI’s long-term manufacturing strategy of delivering high quality, cost effective products to our global customer base. By expanding our assembly offering we are able to provide a total solution, including technical support from our Endicott facility during the new product introduction phase and cost effective, high volume production capability in China,” added Wade Phelan, VP and GM, Complex Assembly Division for EI.
“EI’s success is admirable. After many constructive meetings with mutual trust and respect, we applaud EI for choosing to partner with Lorom in this effort. This union makes our Lorom, Shenzhen plant more valuable than ever. This agreement also offers our employees the opportunity to work with one of the preeminent manufacturing companies while delivering our customers a broad range of high quality products at competitive prices. I strongly believe this partnership will strengthen our high-tech manufacturing development and bring prosperity through a substantial increase in global market share to both companies,” stated YT Yuan, President and CEO of Lorom Industrial Co., LTD.
About Lorom Industrial Co., LTD.
Lorom, established in 1988, is a vertically integrated, global provider for manufacturing and development of PCB assembly, bulk cables and assemblies, power and fiber patch cords, wire harnesses, adapters and terminators and value added solutions. Headquartered in Taipei, Taiwan, Lorom has a worldwide sales presence and state-of-the-art manufacturing capability in Taiwan and mainland China. For more information about Lorom, please visit www.lorom.com
Thursday, June 7, 2007
Baker Announces Equipment Sales to Endicott Interconnect Technologies
M.E. Baker Company's MEI Division today announced the sale of multiple wet process tools to Endicott Interconnect Technologies' (EI). These innovative develop, etch, and strip tools are designed for processing flexible material in discrete and roll form. These tools will be used in the CAMM consortium enhancing set of the tools to have the new generation of R2R processing.
CAMM was established in 2005 when the United States Display Consortium (USDC) selected Binghamton University, EI and Cornell to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry, and academia to tackle the myriad challenges of this emergent technology. In addition to EI , Binghamton University and Cornell, members of CAMM include but are not limited to NASA and USDC, GE, Kodak, and Corning, and Arizona State Universities. Baker is a world leader in the design and manufacture of wet process equipment for a variety of industries including electronics, medical, automotive, defense & aerospace, and consumer products.
Baker's MEI Division offers fully integrated R2R solutions to the printed circuit board and microelectronics industries. With representation in Asia by WKK Distribution, Baker is uniquely positioned to bring R2R solutions from lab scale to high production manufacturing environment. More information can be found on CAMM's website at camm.binghamton.edu, EI's website at endicottinterconnect.com, or Baker's website at mebaker.com
CAMM was established in 2005 when the United States Display Consortium (USDC) selected Binghamton University, EI and Cornell to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry, and academia to tackle the myriad challenges of this emergent technology. In addition to EI , Binghamton University and Cornell, members of CAMM include but are not limited to NASA and USDC, GE, Kodak, and Corning, and Arizona State Universities. Baker is a world leader in the design and manufacture of wet process equipment for a variety of industries including electronics, medical, automotive, defense & aerospace, and consumer products.
Baker's MEI Division offers fully integrated R2R solutions to the printed circuit board and microelectronics industries. With representation in Asia by WKK Distribution, Baker is uniquely positioned to bring R2R solutions from lab scale to high production manufacturing environment. More information can be found on CAMM's website at camm.binghamton.edu, EI's website at endicottinterconnect.com, or Baker's website at mebaker.com
Tuesday, May 29, 2007
Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract
Endicott, NY― Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing. EI has successfully met the stringent DoD qualification requirements for its PCB, module and processing blade production.
This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.
Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.
“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”
“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”
This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.
Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.
“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”
“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”
Thursday, May 24, 2007
Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies
Billerica, MA – Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
Monday, May 21, 2007
HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated Thru-Holes for Increased Circuit Density
Endicott, NY -- Having to drill plated-thru-holes (PTHs) to make signal connections within printed circuit boards (PCBs) may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies (EI). New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Saturday, April 7, 2007
Thin Core Flip Chip Package Provides 199 Micron Via-to-Via Core Pitch
The CoreEZ™ semiconductor package developed by Endicott Interconnect Technologies utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core.
CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Applications
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.
About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.
For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Applications
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.
About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.
For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Wednesday, April 4, 2007
Endicott Interconnect Technologies, Inc. Appoints Director of Engineering
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
Friday, March 23, 2007
Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M
ENDICOTT, NY -- The U.S. Department of Defense has awarded
Endicott Interconnect Technologies, Inc. multiple contracts totaling $164M to produce card frame assemblies including organic semiconductor packaging, module assemblies, printed circuit boards, full functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. EI also provided an innovative and cost effective logistics, shipping and storage solution to the DoD customer in support of this important endeavor.
EI initially recommended its HyperBGA® organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.
Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.
Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.
“Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business,” said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid,” he continued.
“It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs,” stated the DoD customer.
“The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer’s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements,” commented James J. McNamara, President and CEO at EI. “And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof.”
EI initially recommended its HyperBGA® organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.
Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.
Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.
“Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business,” said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid,” he continued.
“It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs,” stated the DoD customer.
“The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer’s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements,” commented James J. McNamara, President and CEO at EI. “And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof.”
Tuesday, March 13, 2007
Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development
Endicott Interconnect Technologies, Inc. has announced the appointment of Rajinder Rai as Vice President, Research & Development reporting to Voya Markovich, effective immediately. He will assume responsibility for the management of resources and support functions for current and future R&D activities in response to business opportunities with state and federal program agencies.
Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.
Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.
“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”
Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.
Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.
“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”
Thursday, February 22, 2007
Technology Neighbors Announce Process Development and Manufacturing Partnership for Medical Application Using World’s Finest Pitch Soldered Flip Chip
ENDICOTT, NY -- Endicott Interconnect Technologies, through their partnership with Unovis-Solutions, announced today that they have entered into a Manufacturing Services Agreement with a leading manufacturer of intravascular ultrasound (IVUS) catheters. Under terms of the Agreement, EI will develop and manufacture a state-of-the-art flexible substrate or circuit and assemble flip chip components to it per the manufacturer’s specifications. EI will procure materials and fixtures to be used in the flexible substrate fabrication and assembly process. The device manufacturer will be responsible for purchasing minimum quantities of the flexible circuit assembly over a 2-year period totaling $3.9 million.
This unique assembly is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. Assembled to this flexible substrate is a PZT (receiver/transmitter) and multiple flip chip die with 22 micron bumps on 70 micron pitch. These are some of the finest pitched, soldered interconnect flip chips in production anywhere in the world today. This distinctive assembly becomes part of an IVUS catheter device, which provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease.
“This opportunity came solely from our relationship with our innovative neighbors up the street, Unovis-Solutions,” stated James J. McNamara, President and CEO at EI. “Their Advanced Process Lab developed and automated critical manufacturing processes for this cutting edge, medical technology. Unovis-Solutions then recommended EI to the end customer for manufacture of the flip-chip assembly and provided us with complete process and equipment implementation guidelines to build the product in volume,” he continued.
EI in turn purchased a GSMxs flip chip placement system from Unovis-Solutions, because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. This advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.
“We recommended EI to partner with us in this endeavor because of their unique substrate development and manufacturing capabilities and their highly skilled teams’ ability to tackle manufacturing challenges that result in excellent quality, high performance solutions,” said George Westby, Director Advanced Process Laboratory at Unovis-Solutions. “EI and Universal Instruments Corporation, and now Unovis-Solutions, have collaborated on many programs. We utilize Universal’s GSM, Genesis™ and AdVantis™ platform systems in multiple lines throughout the plant and have served as a beta site facility for some of their products as well,” commented Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Unovis brings expertise in materials and assembly process development that provides innovative solutions needed to address our unique production demands. Together with Unovis as our partner, we will continue to solve some of the industry’s toughest process and assembly challenges.”
About Unovis-Solutions Unovis-Solutions enables its customers to succeed in the marketplace by partnering throughout all steps of the product life cycle. Customers benefit from Unovis' in-depth knowledge and expertise in electronics assembly, improving speed-to-market, scalability and competitiveness. Unovis offers a broad range of state-of-the-art manufacturing solutions including but not limited to component and die processing, odd form and final assembly, transport systems, flexible process cells and peripherals, and advanced process services and applied research. Established in July 2006 as a strategic merger of four divisions of Universal Instruments and Hover-Davis, Unovis effectively leverages the core competencies and the synergy between these companies. The firm draws on extensive systems integration experience and long-established relationships with third-party sub-system, equipment and process partners. Roland Heitmann, former General Manager of the Hover-Davis Direct Products Division leads the Unovis team.
This unique assembly is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. Assembled to this flexible substrate is a PZT (receiver/transmitter) and multiple flip chip die with 22 micron bumps on 70 micron pitch. These are some of the finest pitched, soldered interconnect flip chips in production anywhere in the world today. This distinctive assembly becomes part of an IVUS catheter device, which provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease.
“This opportunity came solely from our relationship with our innovative neighbors up the street, Unovis-Solutions,” stated James J. McNamara, President and CEO at EI. “Their Advanced Process Lab developed and automated critical manufacturing processes for this cutting edge, medical technology. Unovis-Solutions then recommended EI to the end customer for manufacture of the flip-chip assembly and provided us with complete process and equipment implementation guidelines to build the product in volume,” he continued.
EI in turn purchased a GSMxs flip chip placement system from Unovis-Solutions, because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. This advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.
“We recommended EI to partner with us in this endeavor because of their unique substrate development and manufacturing capabilities and their highly skilled teams’ ability to tackle manufacturing challenges that result in excellent quality, high performance solutions,” said George Westby, Director Advanced Process Laboratory at Unovis-Solutions. “EI and Universal Instruments Corporation, and now Unovis-Solutions, have collaborated on many programs. We utilize Universal’s GSM, Genesis™ and AdVantis™ platform systems in multiple lines throughout the plant and have served as a beta site facility for some of their products as well,” commented Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Unovis brings expertise in materials and assembly process development that provides innovative solutions needed to address our unique production demands. Together with Unovis as our partner, we will continue to solve some of the industry’s toughest process and assembly challenges.”
About Unovis-Solutions Unovis-Solutions enables its customers to succeed in the marketplace by partnering throughout all steps of the product life cycle. Customers benefit from Unovis' in-depth knowledge and expertise in electronics assembly, improving speed-to-market, scalability and competitiveness. Unovis offers a broad range of state-of-the-art manufacturing solutions including but not limited to component and die processing, odd form and final assembly, transport systems, flexible process cells and peripherals, and advanced process services and applied research. Established in July 2006 as a strategic merger of four divisions of Universal Instruments and Hover-Davis, Unovis effectively leverages the core competencies and the synergy between these companies. The firm draws on extensive systems integration experience and long-established relationships with third-party sub-system, equipment and process partners. Roland Heitmann, former General Manager of the Hover-Davis Direct Products Division leads the Unovis team.
Wednesday, January 31, 2007
Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced a job fair scheduled for Saturday, February 3rd from 9am to 1pm at Huron Campus Reception in Endicott, NY. Professional, full-time manufacturing and supplemental manufacturing opportunities are available.
“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.
EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.
Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.
“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.
EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.
Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.
Wednesday, January 3, 2007
Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure
Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.
Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.
Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.
“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.
Warren is based in Louisville, Kentucky where he lives with his wife and two children.
Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.
Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.
“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.
Warren is based in Louisville, Kentucky where he lives with his wife and two children.
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