Thin Core Flip Chip Package Provides 199 Micron Via-to-Via Core Pitch

The CoreEZ™ semiconductor package developed by Endicott Interconnect Technologies utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core.
 


CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
 


Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.

Applications

CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.

About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.

For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc.
1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.

Endicott Interconnect Technologies, Inc. Appoints Director of Engineering

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.

Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.

“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”

Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.