Endicott, NY― Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing. EI has successfully met the stringent DoD qualification requirements for its PCB, module and processing blade production.
This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.
Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.
“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”
“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”
Tuesday, May 29, 2007
Thursday, May 24, 2007
Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies
Billerica, MA – Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
Monday, May 21, 2007
HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated Thru-Holes for Increased Circuit Density
Endicott, NY -- Having to drill plated-thru-holes (PTHs) to make signal connections within printed circuit boards (PCBs) may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies (EI). New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Subscribe to:
Posts (Atom)