Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract

ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) announced today that it has been awarded an initial, multi-year production contract to supply printed circuit boards to Raytheon Company’s Space and Airborne Systems. The boards are used in the Common Integrated Processor (CIP) of the F-22 Raptor.

The F-22 Raptor, utilizing stealth technology, was originally envisioned as an air superiority fighter, but is also equipped for ground attack, electronic warfare and signals intelligence roles. The CIP is the “brains” of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.

After extensive review of technologies and manufacturing capabilities, EI was selected by Raytheon’s McKinney, TX and El Segundo, CA locations. “Our continued progression of yield improvement for these products made complex by the need for dual metallurgy and the stringent requirements surrounding this specification coupled with our meeting the performance and reliability demands led to our win of this program,” stated Eric Hills, Director of Military and Defense Programs at EI.

“This is a significant win because it represents our first contract for production in the aerospace and defense segment for Raytheon. From our initial engagements, we have made the commitment to deliver unparalleled customer service and technical support providing the quality and manufacturability Raytheon requires for its products,” commented EI President and CEO, James J. McNamara. “I’m very proud of the EI team for contributing to Raytheon’s success and it’s our intention to continue doing so for many years to come.”

About Raytheon Company’s Space and Airborne Systems
Space and Airborne Systems business is a $3 billion world leader in the design, development and manufacture of advanced electronic systems for precision engagement; missile defense; and intelligence, surveillance and reconnaissance applications. Key capabilities include electro-optical/infrared sensors, airborne radars, solid state high energy lasers, precision guidance systems, electronic warfare systems and space-qualified systems for civil and military applications. Headquartered in El Segundo, CA, Space and Airborne Systems has 11,000 employees and additional facilities in Goleta, CA; Forest, MS; Dallas, McKinney and Plano, TX; and several international locations.

Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification

ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.

The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.

“This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.