Wednesday, January 31, 2007

Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced a job fair scheduled for Saturday, February 3rd from 9am to 1pm at Huron Campus Reception in Endicott, NY. Professional, full-time manufacturing and supplemental manufacturing opportunities are available.

“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.

EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.

Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.

Wednesday, January 3, 2007

Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure

Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.

Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.

Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.

“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.

Warren is based in Louisville, Kentucky where he lives with his wife and two children.