Endicott, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.
EI assisted Northrop Grumman's Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.
“The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,” explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI's wire bond PBGA organic materials packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.
About Northrop Grumman
Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide.
www.st.northropgrumman.com.
Tuesday, October 30, 2007
Tuesday, October 23, 2007
Endicott Interconnect's SiP Designs Reduce PWB Size, Weight, Complexity and Cost
Endicott, NY -- System in Package (SiP) designs from Endicott Interconnect (EI) Technologies reduce size and weight, sweep multiple packages from a printed wiring board (PWB) into a SiP for improved electrical performance, and reduce PWB complexity and cost. The result is a significant “shrink” in package size and an enormous expansion in performance per sq. in. of PC board real estate.
EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and combining the Company’s extensive experience in thermal solutions with EI’s PTFE-based HyperBGA® or CoreEZ™ organic semiconductor packages featuring thin core build-up flip chip technology. These semiconductor packaging solutions offer exceptional electrical performance, wireability and reliability.
For example, a 7.75” x 15” PCB can be re-designed to a 2.2” x 2.2” size using a 3-4-3 CoreEZ™ substrate with 4 signals, 6 planes and 30 micron lw/ls; and an assembly that includes 5 flip chip FPGAs, CSP memory, passive components, SMT components, PGA connector and 2-sided assembly.
Another SiP conversion using reduced package size components and CoreEZ™ technology condensed a single board computer (SBC) design from 25 sq. in. to 9 sq. in. Also, with extremely thin SiP package on a CoreEZ™ 2-6-2 substrate with buried passives, EI’s SiP designs are not physically limited to a square or rectangular shape, should the application call for something “out of the box”.
Substrate design integration at system level is the key, according to EI, to achieving substantial reduction in PWB design complexity and cost. Elements include:
• Organic substrates for significant weight reduction (thin PTFE substrates are typically 1/10 the weight of a comparable ceramic substrate)
• Thin substrates for significant electrical performance improvements
• SiP designs for shorter signal paths
• Pinned or BGA PWB interface
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and combining the Company’s extensive experience in thermal solutions with EI’s PTFE-based HyperBGA® or CoreEZ™ organic semiconductor packages featuring thin core build-up flip chip technology. These semiconductor packaging solutions offer exceptional electrical performance, wireability and reliability.
For example, a 7.75” x 15” PCB can be re-designed to a 2.2” x 2.2” size using a 3-4-3 CoreEZ™ substrate with 4 signals, 6 planes and 30 micron lw/ls; and an assembly that includes 5 flip chip FPGAs, CSP memory, passive components, SMT components, PGA connector and 2-sided assembly.
Another SiP conversion using reduced package size components and CoreEZ™ technology condensed a single board computer (SBC) design from 25 sq. in. to 9 sq. in. Also, with extremely thin SiP package on a CoreEZ™ 2-6-2 substrate with buried passives, EI’s SiP designs are not physically limited to a square or rectangular shape, should the application call for something “out of the box”.
Substrate design integration at system level is the key, according to EI, to achieving substantial reduction in PWB design complexity and cost. Elements include:
• Organic substrates for significant weight reduction (thin PTFE substrates are typically 1/10 the weight of a comparable ceramic substrate)
• Thin substrates for significant electrical performance improvements
• SiP designs for shorter signal paths
• Pinned or BGA PWB interface
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.
Monday, October 1, 2007
IPC Honors 15 Member Companies with IPC Founders Awards Proving There Is Life After 40
BANNOCKBURN, Ill., ― Association Connecting Electronics Industries® presented 15 member companies with the first-ever IPC Founders Awards for their continuous site memberships of 40 or more years. The companies were recognized during a 50th Anniversary Luncheon at the IPC Midwest Conference & Exhibition on September 26, 2007.
Award recipient companies represented a cross section of original equipment manufacturers (OEMs), suppliers and printed board companies located in North America, Asia and Europe. IPC Founders Awards were presented to:
Ruwel AG. (Geldern, Germany; 40 years) Rohm and Haas (Freeport, N.Y.; 40 years) Yamanashi Avionics Co. (Yamanashi, Japan; 40 years) BGF Industries Inc. (Greensboro, N.C.; 41 years) The Boeing Company (Seattle, Wash.; 41 years) Hexcel (Anderson, S.C.; 41 years) Rockwell Collins (Cedar Rapids, Iowa; 42 years) Sypris Electronics LLC (Tampa, Fla.; 42 years) E.I. du Pont de Nemours and Co. (Circleville, Ohio; 43 years) Harris Corporation (Melbourne, Fla.; 43 years) Honeywell Corporation (Clearwater, Fla.; 43 years) Rogers Corporation (Rogers, Conn.; 43 years) Isola Group SARL (Chandler, Ariz; 47 years) Endicott Interconnect Technologies (Endicott, N.Y.; 48 years) Lockheed Martin Corporation (Oswego, N.Y.; 48 years)
“Over the years, these companies have experienced significant changes ― evolving with their dynamic industry, and in many cases, with new leadership and new names. The fact that these companies are still here today is a testament to their successes in managing, innovating, and serving, first as pioneers and now as leaders,” praised Denny McGuirk, president of IPC. “It has certainly been IPC’s privilege to serve them over these many years, and to work with them in strengthening our industry. These companies continue to pave the way for innovation and IPC salutes them.”
Accepting the award on behalf of Rockwell Collins, Wayne Flory, senior director, Advanced Operations and Services said, “Rockwell Collins has enjoyed a truly collaborative relationship with IPC and its members for the past 42 years. The ability to work with industry experts on a global scale allows us to jointly solve problems more quickly and to apply standards which benefit our company and the entire industry. We are pleased to help celebrate the many achievements of IPC over the past 50 years because we realize many of our own accomplishments have been made possible through the relationships developed here.”
For additional information on the IPC Founders Awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Award recipient companies represented a cross section of original equipment manufacturers (OEMs), suppliers and printed board companies located in North America, Asia and Europe. IPC Founders Awards were presented to:
Ruwel AG. (Geldern, Germany; 40 years) Rohm and Haas (Freeport, N.Y.; 40 years) Yamanashi Avionics Co. (Yamanashi, Japan; 40 years) BGF Industries Inc. (Greensboro, N.C.; 41 years) The Boeing Company (Seattle, Wash.; 41 years) Hexcel (Anderson, S.C.; 41 years) Rockwell Collins (Cedar Rapids, Iowa; 42 years) Sypris Electronics LLC (Tampa, Fla.; 42 years) E.I. du Pont de Nemours and Co. (Circleville, Ohio; 43 years) Harris Corporation (Melbourne, Fla.; 43 years) Honeywell Corporation (Clearwater, Fla.; 43 years) Rogers Corporation (Rogers, Conn.; 43 years) Isola Group SARL (Chandler, Ariz; 47 years) Endicott Interconnect Technologies (Endicott, N.Y.; 48 years) Lockheed Martin Corporation (Oswego, N.Y.; 48 years)
“Over the years, these companies have experienced significant changes ― evolving with their dynamic industry, and in many cases, with new leadership and new names. The fact that these companies are still here today is a testament to their successes in managing, innovating, and serving, first as pioneers and now as leaders,” praised Denny McGuirk, president of IPC. “It has certainly been IPC’s privilege to serve them over these many years, and to work with them in strengthening our industry. These companies continue to pave the way for innovation and IPC salutes them.”
Accepting the award on behalf of Rockwell Collins, Wayne Flory, senior director, Advanced Operations and Services said, “Rockwell Collins has enjoyed a truly collaborative relationship with IPC and its members for the past 42 years. The ability to work with industry experts on a global scale allows us to jointly solve problems more quickly and to apply standards which benefit our company and the entire industry. We are pleased to help celebrate the many achievements of IPC over the past 50 years because we realize many of our own accomplishments have been made possible through the relationships developed here.”
For additional information on the IPC Founders Awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.
About IPC
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
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