ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded certification to the AS9100 Quality Management Standard for aerospace suppliers. This certification signifies that its Endicott, N.Y. facility complies with all requirements of the AS9100 quality management system which covers quality assurance in design, development, production, installation and servicing, as well as purchasing, validation and shipping. The standard includes all ISO 9001:2000 requirements and is expanded to address needs specific to the international aerospace industry.
“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”
Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.
AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.
Tuesday, December 16, 2008
Thursday, December 4, 2008
Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
Friday, October 24, 2008
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Thursday, October 16, 2008
Endicott Interconnect Technologies, Inc. Receives Department of Defense Trusted Foundry Accreditation
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a trusted source to the Department of Defense and all other U.S. government users. Specifically, EI has been awarded Category 1A trusted accreditation for integrated circuits for packaging/ assembly services at its Endicott, N.Y. facility.
Trusted supplier status is awarded to those U.S. companies designing, generating, manufacturing and distributing components that are highly critical to our national security.
“Trusted supplier status is a key element of our strategy moving forward. It guarantees our customer’s access to a trusted supplier for mission critical applications, offers us the ability to fabricate classified designs along with providing access to leading edge technology and support through our industry partnership,” stated Jay McNamara, President and CEO at EI.
The change in industry demographics that has shifted microelectronic packaging expertise and manufacturing off-shore, has led to a reduction in worldwide research and development in advanced packaging and to a lack of new product and process capability within the U.S. As a result, the U.S. Department of Defense and the intelligence community is in need of American companies, positioned ahead of potential adversaries to provide leading technologies and manufacturing capabilities in support of the development of high technology products, or access to emerging technologies.
“Trusted supplier status is a key element of our strategy moving forward. It guarantees our customer’s access to a trusted supplier for mission critical applications, offers us the ability to fabricate classified designs along with providing access to leading edge technology and support through our industry partnership,” stated Jay McNamara, President and CEO at EI.
The change in industry demographics that has shifted microelectronic packaging expertise and manufacturing off-shore, has led to a reduction in worldwide research and development in advanced packaging and to a lack of new product and process capability within the U.S. As a result, the U.S. Department of Defense and the intelligence community is in need of American companies, positioned ahead of potential adversaries to provide leading technologies and manufacturing capabilities in support of the development of high technology products, or access to emerging technologies.
Thursday, October 2, 2008
Jennifer de Souza Promoted to Vice President, Supply Chain Management at Endicott Interconnect Technologies, Inc.
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) today announced a senior management appointment as part of the strategy to drive operational effectiveness. Jennifer de Souza has been promoted to the position of Vice President, Supply Chain Management reporting to Jay McNamara, President and CEO, effective immediately.
Under Ms. de Souza’s leadership, EI is developing and executing direct and indirect materials procurement strategies utilizing lean principles including JIT and Consignment as well as streamlining EI’s Supply Chain through full implementation of the SAP toolset.
Jennifer’s extensive background in leadership roles with world-class companies coupled with her broad knowledge of Supply Chain Management and Procurement will help us attain our goal of continuously improving the delivery of EI solutions to our customers,” commented James J. McNamara, President and CEO at EI.
Ms. de Souza joined EI in April 2007 as Director of Supply Chain Management and has 10 years experience in global materials management and strategic sourcing, most recently as Global Materials Manager at Welch Allyn. Ms. de Souza is a graduate of the Watson School at Binghamton University, holds a Juris Doctor from Syracuse Law School and is RIT certified in lean six sigma green belt methodologies.
Ms. de Souza resides in the Binghamton area with her husband Ian and their two daughters.
Under Ms. de Souza’s leadership, EI is developing and executing direct and indirect materials procurement strategies utilizing lean principles including JIT and Consignment as well as streamlining EI’s Supply Chain through full implementation of the SAP toolset.
Jennifer’s extensive background in leadership roles with world-class companies coupled with her broad knowledge of Supply Chain Management and Procurement will help us attain our goal of continuously improving the delivery of EI solutions to our customers,” commented James J. McNamara, President and CEO at EI.
Ms. de Souza joined EI in April 2007 as Director of Supply Chain Management and has 10 years experience in global materials management and strategic sourcing, most recently as Global Materials Manager at Welch Allyn. Ms. de Souza is a graduate of the Watson School at Binghamton University, holds a Juris Doctor from Syracuse Law School and is RIT certified in lean six sigma green belt methodologies.
Ms. de Souza resides in the Binghamton area with her husband Ian and their two daughters.
Thursday, September 18, 2008
Endicott Interconnect Technologies Prepares For Significant Growth, Modifies Employment Practices and Schedules Job Fair
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has scheduled a job fair for Thursday, September 25th from 4pm to 7pm at EI in Endicott, NY. The company is looking to add over 150 employees during the fourth quarter of 2008. Professional and full-time manufacturing positions are available.
In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.
These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.
EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.
EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.
In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.
These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.
EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.
EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.
Tuesday, August 19, 2008
Felicia Williams Named Vice President of Human Resources at Endicott Interconnect Technologies, Inc.
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has named Felicia Williams to the position of Vice President of Human Resources effective immediately. In this role, Ms. Williams is responsible for leading EI’s human resource programs, including evaluating and determining needs and opportunities, assessing the effectiveness of existing structures and programs and determining strategic goals and implementation plans.
Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward. “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”
Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.
Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward. “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”
Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.
Wednesday, August 6, 2008
Northrop Grumman Corporation Electronic Systems recognizes Endicott Interconnect Technologies for “Raising the Bar in Performance”
The theme of the Northrop Grumman Electronic Systems’ 2008 supplier conference was “Raising the Bar in Performance.” This full day event included presentations by key sector leadership responsible for supplier management, supplier awards and a reception for the award recipients. The NGC Electronic Systems Supply Chain Management (SCM) and Mission Assurance (MA) organizations co-hosted the 2008 Supplier Conference and Awards event at the Historical Electronics Museum in Linthicum, MD on Wednesday, July 23rd, 2008.
The leadership message was clear, the NGES supply base is an essential component of the success of programs, and Northrop Grumman must have a supply base they can depend on for consistent high quality, on-time delivery, cost competitiveness, innovation, and continuous improvement of processes and product.
In addition to the key sector leadership Ed Asher, Mission Systems Sector, Director of Workforce Relations presented on Operation IMPACT (Injured Military Pursuing Assisted Career Transition) and Lieutenant Colonel Wendell Bugg, Integrated Systems Sector Director, Sector Communications, provided a “Voice of the Customer” perspective.
The supplier awards echoed the conference theme and presenters’ messages. The award categories represented the supplier behaviors, attributes or outcomes that Northrop Grumman Electronic Systems values: Customer Service, Strategic Contributions, Continuous Improvement, Innovation, Extraordinary Effort, Life Cycle Cost and overall highest contributor, Supplier-of-the-Year. The Supplier Awards Program construct from nomination to final vetting reinforced a voice of the customer theme and underscored the principle of one Northrop Grumman.
Among the honored suppliers was Endicott Interconnect Technologies, selected for Innovation. Endicott, located in Endicott, New York, is the successor to IBM’s microelectronics division in Endicott, NY. Endicott provides microelectronic solutions provides high density interconnect substrates.
The leadership message was clear, the NGES supply base is an essential component of the success of programs, and Northrop Grumman must have a supply base they can depend on for consistent high quality, on-time delivery, cost competitiveness, innovation, and continuous improvement of processes and product.
In addition to the key sector leadership Ed Asher, Mission Systems Sector, Director of Workforce Relations presented on Operation IMPACT (Injured Military Pursuing Assisted Career Transition) and Lieutenant Colonel Wendell Bugg, Integrated Systems Sector Director, Sector Communications, provided a “Voice of the Customer” perspective.
The supplier awards echoed the conference theme and presenters’ messages. The award categories represented the supplier behaviors, attributes or outcomes that Northrop Grumman Electronic Systems values: Customer Service, Strategic Contributions, Continuous Improvement, Innovation, Extraordinary Effort, Life Cycle Cost and overall highest contributor, Supplier-of-the-Year. The Supplier Awards Program construct from nomination to final vetting reinforced a voice of the customer theme and underscored the principle of one Northrop Grumman.
Among the honored suppliers was Endicott Interconnect Technologies, selected for Innovation. Endicott, located in Endicott, New York, is the successor to IBM’s microelectronics division in Endicott, NY. Endicott provides microelectronic solutions provides high density interconnect substrates.
Tuesday, July 29, 2008
Endicott Interconnect Technologies, Inc. Announces 2008 Scholarship Award Winners
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2008 scholarship program in a breakfast ceremony held at EI on Friday, July 25th. 2008 winners include: Renee Stanke, daughter of Duane and Linda Stanke, who will be attending Broome Community College; Melissa Bates, daughter of Bernita Bates, who will be attending Syracuse University; Richard Hill, son of Richard and Sharon Hill, who will be attending SUNY Stony Brook; Bryan Simpson, son of Dave and Susan Seibold-Simpson, who will be attending Binghamton University; and Amir Merke, son of Tensaew Ashera, who will also be attending Binghamton University.
Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
Wednesday, July 23, 2008
Endicott Interconnect Technologies, Inc. Receives Good Neighbor Award
ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) received the Good Neighbor Award for outstanding support to the American Red Cross Southern Tier Chapter, at a ceremony held at Genegantslet Golf Club on June 26th, 2008.
This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.
“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.
This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.
“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.
Tuesday, July 1, 2008
Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award
Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region. The award, which recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses, was presented at a gala event on June 27th held at the Carnegie Music Hall and Foyer in Pittsburgh, P.A.
McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.
“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”
Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.
About Ernst & Young’s Entrepreneur Of The Year
Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.
About Ernst & Young
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.
McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.
“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”
Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.
About Ernst & Young’s Entrepreneur Of The Year
Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.
About Ernst & Young
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.
Friday, June 27, 2008
ndicott Interconnect Technologies, Inc. Supports the Boy Scouts
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) donated $5,000.00 to the Baden-Powell Council, Boy Scouts of America, in support of an Aquatics Education structure to be built at Camp Tuscarora in Windsor, N.Y. The building will be the centerpiece of the waterfront at the camp and utilized for aquatics training including swimming, boating and fishing. The Baden-Powell Council serves communities in Broome, Chenango, Cortland, southern Seneca, Tioga and Tompkins Counties of New York and Susquehanna County of Pennsylvania.
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
Tuesday, June 17, 2008
Voya R. Markovich named an honored member in technology by Princeton Premier
New York, N.Y. -- Voya R. Markovich, senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., has been chosen for inclusion in the 2008-2009 Princeton Premier Registry.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Tuesday, June 10, 2008
Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.
ENDICOTT, NY -- Congressman Michael Arcuri, representing New York’s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.
James McNamara discussed EI, emphasizing the Company’s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.
A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long range technology efforts,” commented James McNamara.
James McNamara discussed EI, emphasizing the Company’s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.
A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long range technology efforts,” commented James McNamara.
Wednesday, May 28, 2008
Endicott Interconnect Technologies Hosts IPC Technology Interchange Event
ENDICOTT, N.Y.― Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled “Will You Be Ready?: An Endicott Technology Interchange” on Wednesday, May 14th, 2008. The event took place at the Company’s headquarters in Endicott, N.Y. and included a tour of the facility, presentations from EI’s top technologists and a panel discussion featuring leading industry suppliers.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Tuesday, May 6, 2008
Department of Defense Awards Endicott Interconnect Technologies $148.6M Contract Modification
ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. This contract modification period of performance is May, 2008 to December, 2008.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
Thursday, May 1, 2008
Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction
Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.
With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.
“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”
Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.
Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.
“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”
Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.
Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.
Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.
Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.
With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.
“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”
Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.
Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.
“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”
Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.
Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.
Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.
Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
Friday, February 22, 2008
Endicott Interconnect Technologies, Inc. Expands with UK Office and Appoints European Sales Director
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that it has created EI Technologies UK Limited, a wholly owned subsidiary of EI and located in Chelmsford, UK. Steve Payne has been named Director of European Sales reporting to Michael Hills, SVP of Sales, Marketing and Business Development at EI, effective immediately.
Steve will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Steve is also tasked with account penetration of segments targeted for future growth in the European marketplace.
With over 30 years experience in the global electronic packaging industry, Steve brings solid technical knowledge as well as a keen understanding of European business cultures. He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology, Ltd. Steve’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.
"We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” commented Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”
Steve will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Steve is also tasked with account penetration of segments targeted for future growth in the European marketplace.
With over 30 years experience in the global electronic packaging industry, Steve brings solid technical knowledge as well as a keen understanding of European business cultures. He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology, Ltd. Steve’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.
"We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” commented Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”
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