Wednesday, May 28, 2008

Endicott Interconnect Technologies Hosts IPC Technology Interchange Event

ENDICOTT, N.Y.― Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled “Will You Be Ready?: An Endicott Technology Interchange” on Wednesday, May 14th, 2008. The event took place at the Company’s headquarters in Endicott, N.Y. and included a tour of the facility, presentations from EI’s top technologists and a panel discussion featuring leading industry suppliers.

“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.

IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.

“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

Tuesday, May 6, 2008

Department of Defense Awards Endicott Interconnect Technologies $148.6M Contract Modification

ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. This contract modification period of performance is May, 2008 to December, 2008.

“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.

Thursday, May 1, 2008

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.

Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.

With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.

“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”

Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.

Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.

“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”

Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.

Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.

Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.

Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.