New High-Tech Center Creates One-of-a-Kind Electronic Systems Hub

In order to build upon Greater Binghamton's reputation as the premier hub of microelectronic technologies in New York State and utilize the vast existing local and statewide knowledge base, the Research Foundation of State University of New York, with support from Binghamton University and Endicott Interconnect Technologies. Inc., has launched a new collaboration that is expected to greatly accelerate the commercialization of new and improved electronics systems.

The corporation, known as the Binghamton Center for Emerging Technologies (BCET), will work in partnership with commercial, academic, and government agency members, through its New York Systems Integration and Packaging Consortium (NYSIP) to focus on small scale systems integration and packaging projects that could result in a broad range of new commercial and military products.

“Greater Binghamton has a long tradition of expertise in the electronics packaging field,” said Jay McNamara, president and CEO of Endicott Interconnect Technologies. “BCET not only adds to the region’s strengths in the industry but with our one-of-a-kind focus on small systems packaging, it will really put us on the map. Nothing like this exists anywhere else in the United States.”

Tapping into faculty expertise associated with Binghamton University’s Small Scale Systems Integration and Packaging Center (S3IP), the center is expected to serve as a core research facility for advanced technology.

“This initiative underscores the vital role that university-based research plays in driving our economy and will provide additional avenues to build meaningful collaborations with our researchers, “said Bahgat Sammakia, interim vice president of research at Binghamton University.

Launched as a way to meet the Department of Defense’s increasing need for fast turnaround in technology development, BCET will act as a conduit for high-tech federal contracts.

“Public and private partnerships like BCET are essential to translating university research into jobs,” said Congressman Maurice Hinchey (D-NY). “I am pleased that Binghamton University will be strengthening its partnerships with regional businesses like Endicott Interconnect to create and retain jobs related to the development of new commercial and military products. As a member of the House Defense Appropriations Committee, I am happy to have helped put these BCET partners in a position to fulfill technical needs of the Department of Defense and other federal agencies at an accelerated pace.”

Through the collaboration and joint expertise of its members, BCET will be able to develop innovative ideas and solutions much faster and more effectively. In addition, BCET will make it much easier to leverage local resources when it comes to attracting funding and contracts to the region.

“These tough economic times call for creative and collaborative thinking,” said Paul Wolfgramm, Sr., executive director of BCET. “And I believe BCET does exactly that. By joining together the region’s expertise and top-notch resources, the center will not only enhance research and technology transfer opportunities but will also strengthen business-to-business relationships making our region very attractive to outside investment. The result could mean more jobs for our region and make us a great place to start or relocate high-tech businesses.”

BCET membership is open to any organization within the technology area of microelectronics systems integration and packaging. Founding members, the Research Foundation of State University of New York and Endicott Interconnect Technologies, Inc., have already expanded BCET’s membership with the addition of BAE Systems, Inc. and Custom Electronics. Other industries in the region are currently being approached to join the group, which will add to BCET’s capabilities and resources. BCET will be funded strictly through membership dues but could charge fees depending on the nature of the contracts and agreements it is able to secure.

For more information on the organization’s policies and procedures, and application for membership, visit www.bcetny.com

Endicott Interconnect Technologies Announces 2011 Scholarship Award Recipients

Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2011 Scholarship Award Program at a breakfast ceremony held for the awardees and their parents on Wednesday, August 10th. Scholarships were awarded to: Erwing Augustin, son of Marie and Jean Augustin; Ryan Chan, son of On Chung and Benson Chan; Brian Hebbard, son of Denise and Terry Hebbard; Aaron Li, son of Dong and Handong Li; and Deanna Thompson, daughter of Pam and Tony Thompson.

College scholarships are awarded to five dependents of EI employees wishing to further their education. Winners of the $1,500 award were chosen from a very competitive field based upon their academic excellence, extracurricular activities, community service and personal essays. Submissions were evaluated by a panel of judges made up of EI employees.

“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.

“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”

James J. McNamara Jr., President and CEO at EI, presented the awards to the winning students and their parents at the breakfast. “EI proudly sponsors this annual scholarship program in support of our employees and their families. These students demonstrate outstanding character and commitment to their community, as well as academic excellence and EI is delighted to be able to provide them with the means to help further their education. We would like to congratulate you on your accomplishments and wish you the best of luck in the coming academic year,” he commented.

Warren Dannelly Appointed to Vice President of Worldwide Sales

Warren Dannelly has been recently appointed to Vice President of Worldwide Sales. In his new position, Warren will be responsible for all of EI’s 12 direct sales force in the US and Europe, as well as the 6 US rep companies totaling 34 sales people and 7 European rep companies totaling 37 sales people. In addition, he has the field sales and operational responsibility for the EI / AVNET / IBM Secure Micro Solutions (SMS) business partnership, which today includes 33 regional offices for AVNET and 321 people.

Prior to EI, Warren was the Director of Sales for Texas Instruments Defense Systems which
was acquired by Raytheon Corporation and then Tyco Electronics Printed Circuit Group, as the Director of Sales for Aerospace and Defense.

Warren began his career as a Quality Engineer at Texas Instruments in 1979 and advanced to Quality Manager in 1983 before becoming promoted to the Director of Quality at NTI in 1996. Warren also worked for the Digital Equipment Corporation as Director of Quality and became Director of Business Development in 1991.

Warren served in the United States Air Force from 1973 to 1979. He graduated with a BS in Industrial Technology from Southern Illinois University, Carbondale, Illinois where he graduated with honors.

Endicott Interconnect Receives More Than $100 Million in Defense Contracts

Endicott Interconnect Technologies announced it was awarded $101 million in Defense Department contracts in 2010 and this year to date.

EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010.

This year, EI was awarded two hardware sustainment contracts, valued at $2.1 million and $9.5 million. The latter is a 10-year contract, the company said.

Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronic packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.

"This is a significant step forward in the next generation of high-performance computing and utilizes some of the most advanced electronic packaging solutions available in industry today," said Eric Hills, vice president -- business development/program office at EI. "EI had managed the program from the system's design and development phase through prototype and pre-production and is very excited to begin full production."

EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets.

James J. McNamara Jr. Inducted into the Manufacturers Association of Central New York's Wall of Fame

James J. McNamara Jr. (Jay), President and CEO of Endicott Interconnect Technologies, Inc. will be honored for his lifetime achievements in manufacturing, by being inducted into the Manufacturers Association of Central New York (MACNY) Wall of Fame on May 12, 2011 at the Syracuse Oncenter.

Jay began his career as a Time Study Engineer at Burlington Industries in 1966. In 1972 he took a position with Amp Incorporated where Jay fine tuned his leadership abilities, enabling him to hold multiple executive positions with Amp and later Tyco Electronics. In 1995, Jay was appointed Vice President of Tyco Electronics assuming responsibility of 12 companies with Tyco located throughout 45 countries. Under Jay’s leadership and management, the wire and
cable business grew organically and via acquisition to $1.6 billion in annual sales.

In November 2002, Jay accepted the President/CEO position of newly formed Endicott Interconnect Technologies, Inc. Jay saw opportunity for growth
and expansion of the former IBM Microelectronics manufacturing site, through diversifying product offerings, advancing technology and expanding the customer base from a handful to over 130. EI has grown into an internationally renowned supplier of advanced electronic packaging solutions serving customers in the medical, defense/aerospace and high end computing markets.

The Manufacturers Association of Central New York (MACNY) advocates for the growth and development of New York’s manufacturing sector, a critical component of a vibrant New York economy. In total, the Manufacturers Association represents approximately 350 business and 55,000 workers across nineteen counties in Upstate New York.

Founded in 1913, MACNY is the largest associations of manufacturers in New York State and one of the oldest manufacturers associations in the nation. More information on MACNY can be found at www.macny.org.

Endicott Interconnect Technologies, Inc. names Michael J. Hills Chief Operating Officer

Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Michael J. Hills to the position of Chief Operating Officer (COO) reporting to James J. McNamara Jr., President and CEO. In his new position, Mike will be responsible for all manufacturing, engineering, supply chain, quality and facilities operations at the Endicott, NY location.

“As COO, Mike will focus his efforts on establishing new processes and controls to reduce operating expenses, maximizing manufacturing efficiencies and drive improvement to on-time delivery”, stated Mr. McNamara. “With his extensive background in both sales and operations, Mike is uniquely suited to translate the needs of the marketplace to operational excellence for continued growth and profitability of EI.”

Mike previously served as the Senior Vice President of Sales, Marketing and Product Management for EI. He has held a variety of senior executive positions since joining EI in December 2002 as Vice President of Business Development. Prior to EI, Mike worked for the IBM Corporation. He served in several key management positions including Superintendent of IBM Endicott Manufacturing Operations, and Manager of Engineering and Manufacturing Operations at the IBM Dublin, Ireland Server Group plant.

Mike holds a Bachelor of Science degree in Mechanical Engineering from Penn State University and a Masters in Business Administration from Cornell University S.C. Johnson Graduate School of Management.