Endicott Interconnect

EI's Dr. Mark Poliks' Interview With "Real Time With IPC"

2012-03-02T10:12:00.000-08:00

Dr. Mark Poliks, director or Research & Development at Endicott Interconnect Technologies, describes some of the current and emerging capabilities for high-density and high-performance electronic interconnection products that are, or will soon be, available at EI.

Watch the video here

Cambridge Who's Who Names Annamaria Mastronardi Professional of the Year in Human Resources

2012-02-15T10:45:00.000-08:00

ENDICOTT, NY, -- Annamaria Mastronardi, Director of Human Resources for Endicott Interconnect Technologies, has been named a Cambridge Who's Who Professional of the Year in Human Resources. While inclusion in the Cambridge Who's Who Registry is an honor, only a small selection of members in each discipline are chosen for this distinction. These special honorees are distinguished based on their professional accomplishments, academic achievements, leadership abilities, years of service, and the credentials they have provided in association with their Cambridge Who's Who membership.

As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.

Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.

Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.

About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.

Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel

2012-02-07T06:13:00.000-08:00

ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.

"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”

Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".

About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.

About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.

Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.

What's New About the EI Website?

2012-01-30T07:16:00.000-08:00

EI has been in business for almost 10 years, has expanded into many new markets and has created products for hundreds of new customers. Unfortunately, our old website did not have the functionality or capability to adequately reflect these changes in our growing business. We decided to make significant improvements to our web presence in late 2011 when we partnered with Vibrant Creative to completely redesign and revamp our website. Below are the top 5 major areas of the website that we felt would create a more fluid and informative experience for our customers, suppliers and employees. The proceeding information will also act as a tool to help guide you, the visitor, through the new website to ensure that your time spent on the EI site is engaging as well as enjoyable.

New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.

Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.

Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.

Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.

Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.

Endicott Interconnect Technologies, Inc. Announces the Launch of Their New Website

2012-01-26T07:32:00.000-08:00

Over the past several months Endicott Interconnect has been working hand-in-hand with web developers, Vibrant Creative, to upgrade and revitalize their web presence.

The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.

To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.

Endicott Interconnect Technologies, Inc. Honors Employees at Eighth Annual Patent Award and Trade Secret Dinner

2012-01-18T06:07:00.000-08:00

ENDICOTT, NY—Endicott Interconnect Technologies, Inc. (EI) honored 23 employees for patent applications filed, U.S. patents issued and trade secrets received in 2010 at an awards dinner and ceremony held Friday, January 13^th 2012 at De Gennaro’s in Endicott, N.Y.

Awards were presented to: Dave Alcoe, Ash Bhatt, Kim Blackwell, Barry Bonitz, Benson Chan, Rabindra Das, Frank Egitto, Mike Hills, John Lauffer, How Lin, Roy Magnuson, Jay McNamara, Frank Marconi, Voya Markovich, Luis Matienzo, Tom Miller, Kostas Papathomas, Mark Poliks, Steve Rosser, Duane Stanke, Bob Testa, Bill Wilson, and Michael Wozniak.

“I am very proud of these individuals whose bold invention, creativity and technological innovation has contributed to the success of EI, ensuring our technical vitality and competitiveness in the open market. The hard work of those being honored tonight is a testament to the truly great things being developed by Endicott Interconnect,” commented James McNamara, President and CEO at EI.

Currently, Endicott Interconnect holds 129 U.S. patents and 32 Trade Secrets.

New High-Tech Center Creates One-of-a-Kind Electronic Systems Hub

2011-11-07T09:00:00.000-08:00

In order to build upon Greater Binghamton's reputation as the premier hub of microelectronic technologies in New York State and utilize the vast existing local and statewide knowledge base, the Research Foundation of State University of New York, with support from Binghamton University and Endicott Interconnect Technologies. Inc., has launched a new collaboration that is expected to greatly accelerate the commercialization of new and improved electronics systems.

The corporation, known as the Binghamton Center for Emerging Technologies (BCET), will work in partnership with commercial, academic, and government agency members, through its New York Systems Integration and Packaging Consortium (NYSIP) to focus on small scale systems integration and packaging projects that could result in a broad range of new commercial and military products.

“Greater Binghamton has a long tradition of expertise in the electronics packaging field,” said Jay McNamara, president and CEO of Endicott Interconnect Technologies. “BCET not only adds to the region’s strengths in the industry but with our one-of-a-kind focus on small systems packaging, it will really put us on the map. Nothing like this exists anywhere else in the United States.”

Tapping into faculty expertise associated with Binghamton University’s Small Scale Systems Integration and Packaging Center (S3IP), the center is expected to serve as a core research facility for advanced technology.

“This initiative underscores the vital role that university-based research plays in driving our economy and will provide additional avenues to build meaningful collaborations with our researchers, “said Bahgat Sammakia, interim vice president of research at Binghamton University.

Launched as a way to meet the Department of Defense’s increasing need for fast turnaround in technology development, BCET will act as a conduit for high-tech federal contracts.

“Public and private partnerships like BCET are essential to translating university research into jobs,” said Congressman Maurice Hinchey (D-NY). “I am pleased that Binghamton University will be strengthening its partnerships with regional businesses like Endicott Interconnect to create and retain jobs related to the development of new commercial and military products. As a member of the House Defense Appropriations Committee, I am happy to have helped put these BCET partners in a position to fulfill technical needs of the Department of Defense and other federal agencies at an accelerated pace.”

Through the collaboration and joint expertise of its members, BCET will be able to develop innovative ideas and solutions much faster and more effectively. In addition, BCET will make it much easier to leverage local resources when it comes to attracting funding and contracts to the region.

“These tough economic times call for creative and collaborative thinking,” said Paul Wolfgramm, Sr., executive director of BCET. “And I believe BCET does exactly that. By joining together the region’s expertise and top-notch resources, the center will not only enhance research and technology transfer opportunities but will also strengthen business-to-business relationships making our region very attractive to outside investment. The result could mean more jobs for our region and make us a great place to start or relocate high-tech businesses.”

BCET membership is open to any organization within the technology area of microelectronics systems integration and packaging. Founding members, the Research Foundation of State University of New York and Endicott Interconnect Technologies, Inc., have already expanded BCET’s membership with the addition of BAE Systems, Inc. and Custom Electronics. Other industries in the region are currently being approached to join the group, which will add to BCET’s capabilities and resources. BCET will be funded strictly through membership dues but could charge fees depending on the nature of the contracts and agreements it is able to secure.

For more information on the organization’s policies and procedures, and application for membership, visit www.bcetny.com

Endicott Interconnect Technologies Announces 2011 Scholarship Award Recipients

2011-10-25T09:09:00.000-07:00

Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2011 Scholarship Award Program at a breakfast ceremony held for the awardees and their parents on Wednesday, August 10th. Scholarships were awarded to: Erwing Augustin, son of Marie and Jean Augustin; Ryan Chan, son of On Chung and Benson Chan; Brian Hebbard, son of Denise and Terry Hebbard; Aaron Li, son of Dong and Handong Li; and Deanna Thompson, daughter of Pam and Tony Thompson.

College scholarships are awarded to five dependents of EI employees wishing to further their education. Winners of the $1,500 award were chosen from a very competitive field based upon their academic excellence, extracurricular activities, community service and personal essays. Submissions were evaluated by a panel of judges made up of EI employees.

“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.

“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”

James J. McNamara Jr., President and CEO at EI, presented the awards to the winning students and their parents at the breakfast. “EI proudly sponsors this annual scholarship program in support of our employees and their families. These students demonstrate outstanding character and commitment to their community, as well as academic excellence and EI is delighted to be able to provide them with the means to help further their education. We would like to congratulate you on your accomplishments and wish you the best of luck in the coming academic year,” he commented.

Warren Dannelly Appointed to Vice President of Worldwide Sales

2011-07-20T09:10:00.000-07:00

Warren Dannelly has been recently appointed to Vice President of Worldwide Sales. In his new position, Warren will be responsible for all of EI’s 12 direct sales force in the US and Europe, as well as the 6 US rep companies totaling 34 sales people and 7 European rep companies totaling 37 sales people. In addition, he has the field sales and operational responsibility for the EI / AVNET / IBM Secure Micro Solutions (SMS) business partnership, which today includes 33 regional offices for AVNET and 321 people.

Prior to EI, Warren was the Director of Sales for Texas Instruments Defense Systems which
was acquired by Raytheon Corporation and then Tyco Electronics Printed Circuit Group, as the Director of Sales for Aerospace and Defense.

Warren began his career as a Quality Engineer at Texas Instruments in 1979 and advanced to Quality Manager in 1983 before becoming promoted to the Director of Quality at NTI in 1996. Warren also worked for the Digital Equipment Corporation as Director of Quality and became Director of Business Development in 1991.

Warren served in the United States Air Force from 1973 to 1979. He graduated with a BS in Industrial Technology from Southern Illinois University, Carbondale, Illinois where he graduated with honors.

Endicott Interconnect Receives More Than $100 Million in Defense Contracts

2011-06-24T09:00:00.000-07:00

Endicott Interconnect Technologies announced it was awarded $101 million in Defense Department contracts in 2010 and this year to date.

EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010.

This year, EI was awarded two hardware sustainment contracts, valued at $2.1 million and $9.5 million. The latter is a 10-year contract, the company said.

Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronic packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.

"This is a significant step forward in the next generation of high-performance computing and utilizes some of the most advanced electronic packaging solutions available in industry today," said Eric Hills, vice president -- business development/program office at EI. "EI had managed the program from the system's design and development phase through prototype and pre-production and is very excited to begin full production."

EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets.

James J. McNamara Jr. Inducted into the Manufacturers Association of Central New York's Wall of Fame

2011-05-11T09:00:00.000-07:00

James J. McNamara Jr. (Jay), President and CEO of Endicott Interconnect Technologies, Inc. will be honored for his lifetime achievements in manufacturing, by being inducted into the Manufacturers Association of Central New York (MACNY) Wall of Fame on May 12, 2011 at the Syracuse Oncenter.

Jay began his career as a Time Study Engineer at Burlington Industries in 1966. In 1972 he took a position with Amp Incorporated where Jay fine tuned his leadership abilities, enabling him to hold multiple executive positions with Amp and later Tyco Electronics. In 1995, Jay was appointed Vice President of Tyco Electronics assuming responsibility of 12 companies with Tyco located throughout 45 countries. Under Jay’s leadership and management, the wire and
cable business grew organically and via acquisition to $1.6 billion in annual sales.

In November 2002, Jay accepted the President/CEO position of newly formed Endicott Interconnect Technologies, Inc. Jay saw opportunity for growth
and expansion of the former IBM Microelectronics manufacturing site, through diversifying product offerings, advancing technology and expanding the customer base from a handful to over 130. EI has grown into an internationally renowned supplier of advanced electronic packaging solutions serving customers in the medical, defense/aerospace and high end computing markets.

The Manufacturers Association of Central New York (MACNY) advocates for the growth and development of New York’s manufacturing sector, a critical component of a vibrant New York economy. In total, the Manufacturers Association represents approximately 350 business and 55,000 workers across nineteen counties in Upstate New York.

Founded in 1913, MACNY is the largest associations of manufacturers in New York State and one of the oldest manufacturers associations in the nation. More information on MACNY can be found at www.macny.org.

Endicott Interconnect Technologies, Inc. names Michael J. Hills Chief Operating Officer

2011-04-20T09:00:00.000-07:00

Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Michael J. Hills to the position of Chief Operating Officer (COO) reporting to James J. McNamara Jr., President and CEO. In his new position, Mike will be responsible for all manufacturing, engineering, supply chain, quality and facilities operations at the Endicott, NY location.

“As COO, Mike will focus his efforts on establishing new processes and controls to reduce operating expenses, maximizing manufacturing efficiencies and drive improvement to on-time delivery”, stated Mr. McNamara. “With his extensive background in both sales and operations, Mike is uniquely suited to translate the needs of the marketplace to operational excellence for continued growth and profitability of EI.”

Mike previously served as the Senior Vice President of Sales, Marketing and Product Management for EI. He has held a variety of senior executive positions since joining EI in December 2002 as Vice President of Business Development. Prior to EI, Mike worked for the IBM Corporation. He served in several key management positions including Superintendent of IBM Endicott Manufacturing Operations, and Manager of Engineering and Manufacturing Operations at the IBM Dublin, Ireland Server Group plant.

Mike holds a Bachelor of Science degree in Mechanical Engineering from Penn State University and a Masters in Business Administration from Cornell University S.C. Johnson Graduate School of Management.

Endicott Interconnect Technologies, Inc. Achieves AS9100 Aerospace Certification with 100% Score

2008-12-16T08:45:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded certification to the AS9100 Quality Management Standard for aerospace suppliers. This certification signifies that its Endicott, N.Y. facility complies with all requirements of the AS9100 quality management system which covers quality assurance in design, development, production, installation and servicing, as well as purchasing, validation and shipping. The standard includes all ISO 9001:2000 requirements and is expanded to address needs specific to the international aerospace industry.

“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”

Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.

AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.

Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract

2008-12-04T08:46:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.

This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.

Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.

The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.

Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values

2008-10-24T08:53:00.000-07:00

ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.

Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.

Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”

About the Award 
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.

 About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.

Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values

2008-10-24T08:48:00.000-07:00

ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.

Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.

Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.

 About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.

Endicott Interconnect Technologies, Inc. Receives Department of Defense Trusted Foundry Accreditation

2008-10-16T08:54:00.000-07:00

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a trusted source to the Department of Defense and all other U.S. government users. Specifically, EI has been awarded Category 1A trusted accreditation for integrated circuits for packaging/ assembly services at its Endicott, N.Y. facility.    Trusted supplier status is awarded to those U.S. companies designing, generating, manufacturing and distributing components that are highly critical to our national security.

“Trusted supplier status is a key element of our strategy moving forward. It guarantees our customer’s access to a trusted supplier for mission critical applications, offers us the ability to fabricate classified designs along with providing access to leading edge technology and support through our industry partnership,” stated Jay McNamara, President and CEO at EI.

The change in industry demographics that has shifted microelectronic packaging expertise and manufacturing off-shore, has led to a reduction in worldwide research and development in advanced packaging and to a lack of new product and process capability within the U.S. As a result, the U.S. Department of Defense and the intelligence community is in need of American companies, positioned ahead of potential adversaries to provide leading technologies and manufacturing capabilities in support of the development of high technology products, or access to emerging technologies.

Jennifer de Souza Promoted to Vice President, Supply Chain Management at Endicott Interconnect Technologies, Inc.

2008-10-02T08:55:00.000-07:00

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) today announced a senior management appointment as part of the strategy to drive operational effectiveness. Jennifer de Souza has been promoted to the position of Vice President, Supply Chain Management reporting to Jay McNamara, President and CEO, effective immediately.

Under Ms. de Souza’s leadership, EI is developing and executing direct and indirect materials procurement strategies utilizing lean principles including JIT and Consignment as well as streamlining EI’s Supply Chain through full implementation of the SAP toolset.

Jennifer’s extensive background in leadership roles with world-class companies coupled with her broad knowledge of Supply Chain Management and Procurement will help us attain our goal of continuously improving the delivery of EI solutions to our customers,” commented James J. McNamara, President and CEO at EI.

Ms. de Souza joined EI in April 2007 as Director of Supply Chain Management and has 10 years experience in global materials management and strategic sourcing, most recently as Global Materials Manager at Welch Allyn. Ms. de Souza is a graduate of the Watson School at Binghamton University, holds a Juris Doctor from Syracuse Law School and is RIT certified in lean six sigma green belt methodologies.

Ms. de Souza resides in the Binghamton area with her husband Ian and their two daughters.

Endicott Interconnect Technologies Prepares For Significant Growth, Modifies Employment Practices and Schedules Job Fair

2008-09-18T09:00:00.000-07:00

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has scheduled a job fair for Thursday, September 25th from 4pm to 7pm at EI in Endicott, NY. The company is looking to add over 150 employees during the fourth quarter of 2008. Professional and full-time manufacturing positions are available.

In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.

These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.

EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.

EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.

Felicia Williams Named Vice President of Human Resources at Endicott Interconnect Technologies, Inc.

2008-08-19T09:03:00.000-07:00

ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has named Felicia Williams to the position of Vice President of Human Resources effective immediately. In this role, Ms. Williams is responsible for leading EI’s human resource programs, including evaluating and determining needs and opportunities, assessing the effectiveness of existing structures and programs and determining strategic goals and implementation plans.

Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward.   “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”

Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.

Northrop Grumman Corporation Electronic Systems recognizes Endicott Interconnect Technologies for “Raising the Bar in Performance”

2008-08-06T09:01:00.000-07:00

The theme of the Northrop Grumman Electronic Systems’ 2008 supplier conference was “Raising the Bar in Performance.” This full day event included presentations by key sector leadership responsible for supplier management, supplier awards and a reception for the award recipients. The NGC Electronic Systems Supply Chain Management (SCM) and Mission Assurance (MA) organizations co-hosted the 2008 Supplier Conference and Awards event at the Historical Electronics Museum in Linthicum, MD on Wednesday, July 23rd, 2008.

The leadership message was clear, the NGES supply base is an essential component of the success of programs, and Northrop Grumman must have a supply base they can depend on for consistent high quality, on-time delivery, cost competitiveness, innovation, and continuous improvement of processes and product.

In addition to the key sector leadership Ed Asher, Mission Systems Sector, Director of Workforce Relations presented on Operation IMPACT (Injured Military Pursuing Assisted Career Transition) and Lieutenant Colonel Wendell Bugg, Integrated Systems Sector Director, Sector Communications, provided a “Voice of the Customer” perspective.

The supplier awards echoed the conference theme and presenters’ messages. The award categories represented the supplier behaviors, attributes or outcomes that Northrop Grumman Electronic Systems values: Customer Service, Strategic Contributions, Continuous Improvement, Innovation, Extraordinary Effort, Life Cycle Cost and overall highest contributor, Supplier-of-the-Year. The Supplier Awards Program construct from nomination to final vetting reinforced a voice of the customer theme and underscored the principle of one Northrop Grumman.

Among the honored suppliers was Endicott Interconnect Technologies, selected for Innovation. Endicott, located in Endicott, New York, is the successor to IBM’s microelectronics division in Endicott, NY. Endicott provides microelectronic solutions provides high density interconnect substrates.

Endicott Interconnect Technologies, Inc. Announces 2008 Scholarship Award Winners

2008-07-29T09:05:00.000-07:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2008 scholarship program in a breakfast ceremony held at EI on Friday, July 25th. 2008 winners include: Renee Stanke, daughter of Duane and Linda Stanke, who will be attending Broome Community College; Melissa Bates, daughter of Bernita Bates, who will be attending Syracuse University; Richard Hill, son of Richard and Sharon Hill, who will be attending SUNY Stony Brook; Bryan Simpson, son of Dave and Susan Seibold-Simpson, who will be attending Binghamton University; and Amir Merke, son of Tensaew Ashera, who will also be attending Binghamton University.

Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.

“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”

Endicott Interconnect Technologies, Inc. Receives Good Neighbor Award

2008-07-23T09:06:00.000-07:00

ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) received the Good Neighbor Award for outstanding support to the American Red Cross Southern Tier Chapter, at a ceremony held at Genegantslet Golf Club on June 26th, 2008.

This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.

“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

2008-07-01T09:07:00.000-07:00

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region. The award, which recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses, was presented at a gala event on June 27th held at the Carnegie Music Hall and Foyer in Pittsburgh, P.A.

McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.

“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”

Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.

About Ernst & Young’s Entrepreneur Of The Year
 Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.

About Ernst & Young 
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.

ndicott Interconnect Technologies, Inc. Supports the Boy Scouts

2008-06-27T09:10:00.000-07:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) donated $5,000.00 to the Baden-Powell Council, Boy Scouts of America, in support of an Aquatics Education structure to be built at Camp Tuscarora in Windsor, N.Y. The building will be the centerpiece of the waterfront at the camp and utilized for aquatics training including swimming, boating and fishing. The Baden-Powell Council serves communities in Broome, Chenango, Cortland, southern Seneca, Tioga and Tompkins Counties of New York and Susquehanna County of Pennsylvania.

“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”

Voya R. Markovich named an honored member in technology by Princeton Premier

2008-06-17T09:11:00.000-07:00

New York, N.Y. -- Voya R. Markovich, senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., has been chosen for inclusion in the 2008-2009 Princeton Premier Registry.

Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.

In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

2008-06-10T09:13:00.000-07:00

ENDICOTT, NY -- Congressman Michael Arcuri, representing New York’s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.

James McNamara discussed EI, emphasizing the Company’s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.

A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.

“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long range technology efforts,” commented James McNamara.

Endicott Interconnect Technologies Hosts IPC Technology Interchange Event

2008-05-28T09:15:00.000-07:00

ENDICOTT, N.Y.― Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled “Will You Be Ready?: An Endicott Technology Interchange” on Wednesday, May 14th, 2008. The event took place at the Company’s headquarters in Endicott, N.Y. and included a tour of the facility, presentations from EI’s top technologists and a panel discussion featuring leading industry suppliers.

“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.

IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.

“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.

About IPC
 IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

Department of Defense Awards Endicott Interconnect Technologies $148.6M Contract Modification

2008-05-06T09:17:00.000-07:00

ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. This contract modification period of performance is May, 2008 to December, 2008.

“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

2008-05-01T08:40:00.000-07:00

Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.

Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.

With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.

“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”

Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.

Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.

“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”

Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.

Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.

Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.

Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.

Endicott Interconnect Technologies, Inc. Expands with UK Office and Appoints European Sales Director

2008-02-22T08:42:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that it has created EI Technologies UK Limited, a wholly owned subsidiary of EI and located in Chelmsford, UK. Steve Payne has been named Director of European Sales reporting to Michael Hills, SVP of Sales, Marketing and Business Development at EI, effective immediately.

Steve will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Steve is also tasked with account penetration of segments targeted for future growth in the European marketplace.

With over 30 years experience in the global electronic packaging industry, Steve brings solid technical knowledge as well as a keen understanding of European business cultures. He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology, Ltd. Steve’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.

"We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” commented Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”

Endicott Interconnect Technologies (EI) Buys 4 More Schmoll Machines

2007-11-12T09:19:00.000-08:00

Garden Grove, CA -- Dave Howard, Vice President and COO for Burkle North America's FabFour Group, announced today that Endicott Interconnect Technologies has placed an order for another four (4) MX-1 XXL advanced high speed drilling machines from Schmoll Maschinen (Germany). They have again chosen a mix of single station single head machines and also single station dual head machines (one drilling and one routing) with the added option of vision. EI now has a total of 8 units from Schmoll.

Schmoll, located near Frankfurt, Germany is part of Burkle's FabFour Machinery Alliance consisting of Burkle Lamination and Coating Systems, Posalux high volume drilling and routing systems, Bacher Registration and Exposure Systems and LHMT Scoring and Beveling equipment.

 For more information, contact Dave Howard, at 714-379-5090, or visit Burkle North America's Web Site at www.burkleusa.com.

Endicott Interconnect Technologies' Wire Bond Product Launched into Space

2007-10-30T09:21:00.000-07:00

Endicott, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.

EI assisted Northrop Grumman's Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.

“The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,” explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI's wire bond PBGA organic materials packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.

About Northrop Grumman Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide.  www.st.northropgrumman.com.

Endicott Interconnect's SiP Designs Reduce PWB Size, Weight, Complexity and Cost

2007-10-23T09:23:00.000-07:00

Endicott, NY -- System in Package (SiP) designs from Endicott Interconnect (EI) Technologies reduce size and weight, sweep multiple packages from a printed wiring board (PWB) into a SiP for improved electrical performance, and reduce PWB complexity and cost. The result is a significant “shrink” in package size and an enormous expansion in performance per sq. in. of PC board real estate.

EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and combining the Company’s extensive experience in thermal solutions with EI’s PTFE-based HyperBGA® or CoreEZ™ organic semiconductor packages featuring thin core build-up flip chip technology. These semiconductor packaging solutions offer exceptional electrical performance, wireability and reliability.

For example, a 7.75” x 15” PCB can be re-designed to a 2.2” x 2.2” size using a 3-4-3 CoreEZ™ substrate with 4 signals, 6 planes and 30 micron lw/ls; and an assembly that includes 5 flip chip FPGAs, CSP memory, passive components, SMT components, PGA connector and 2-sided assembly.

Another SiP conversion using reduced package size components and CoreEZ™ technology condensed a single board computer (SBC) design from 25 sq. in. to 9 sq. in. Also, with extremely thin SiP package on a CoreEZ™ 2-6-2 substrate with buried passives, EI’s SiP designs are not physically limited to a square or rectangular shape, should the application call for something “out of the box”.

Substrate design integration at system level is the key, according to EI, to achieving substantial reduction in PWB design complexity and cost. Elements include: 
• Organic substrates for significant weight reduction (thin PTFE substrates are typically 1/10 the weight of a comparable ceramic substrate)
 • Thin substrates for significant electrical performance improvements  
• SiP designs for shorter signal paths
 • Pinned or BGA PWB interface
For more information, contact Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit www.eitny.com.

IPC Honors 15 Member Companies with IPC Founders Awards Proving There Is Life After 40

2007-10-01T09:25:00.000-07:00

BANNOCKBURN, Ill., ― Association Connecting Electronics Industries® presented 15 member companies with the first-ever IPC Founders Awards for their continuous site memberships of 40 or more years. The companies were recognized during a 50th Anniversary Luncheon at the IPC Midwest Conference & Exhibition on September 26, 2007.

Award recipient companies represented a cross section of original equipment manufacturers (OEMs), suppliers and printed board companies located in North America, Asia and Europe. IPC Founders Awards were presented to:

Ruwel AG. (Geldern, Germany; 40 years)  Rohm and Haas (Freeport, N.Y.; 40 years)  Yamanashi Avionics Co. (Yamanashi, Japan; 40 years)  BGF Industries Inc. (Greensboro, N.C.; 41 years)  The Boeing Company (Seattle, Wash.; 41 years)  Hexcel (Anderson, S.C.; 41 years)  Rockwell Collins (Cedar Rapids, Iowa; 42 years)  Sypris Electronics LLC (Tampa, Fla.; 42 years)  E.I. du Pont de Nemours and Co. (Circleville, Ohio; 43 years)  Harris Corporation (Melbourne, Fla.; 43 years)  Honeywell Corporation (Clearwater, Fla.; 43 years)  Rogers Corporation (Rogers, Conn.; 43 years)  Isola Group SARL (Chandler, Ariz; 47 years)  Endicott Interconnect Technologies (Endicott, N.Y.; 48 years)  Lockheed Martin Corporation (Oswego, N.Y.; 48 years)

 “Over the years, these companies have experienced significant changes ― evolving with their dynamic industry, and in many cases, with new leadership and new names. The fact that these companies are still here today is a testament to their successes in managing, innovating, and serving, first as pioneers and now as leaders,” praised Denny McGuirk, president of IPC. “It has certainly been IPC’s privilege to serve them over these many years, and to work with them in strengthening our industry. These companies continue to pave the way for innovation and IPC salutes them.”

Accepting the award on behalf of Rockwell Collins, Wayne Flory, senior director, Advanced Operations and Services said, “Rockwell Collins has enjoyed a truly collaborative relationship with IPC and its members for the past 42 years. The ability to work with industry experts on a global scale allows us to jointly solve problems more quickly and to apply standards which benefit our company and the entire industry. We are pleased to help celebrate the many achievements of IPC over the past 50 years because we realize many of our own accomplishments have been made possible through the relationships developed here.”

For additional information on the IPC Founders Awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.

About IPC 
IPC (www.ipc.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,500 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

PCB Assemblies for High Volume Commercial Applications from Endicott Interconnect Technologies

2007-09-27T09:51:00.000-07:00

ENDICOTT, NY -- PC board assembly specialist Endicott Interconnect (EI) Technologies now offers high-volume, low-cost, fully assembled PC boards via EI Shenzhen, its new 40,000 sq. ft. facility in China.

“Customers will continue to receive technical support through EI Endicott for new product development and introduction, but once volume production ramps up for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, Product Manager of EI Complex Assembly Operations. PCBs can be assembled in the high volumes necessary to meet customer requirements and EI is committed to adding incremental capacity as needed.

EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 18” x 24” (457 mm x 610 mm) for SMT or non-SMT backplanes.

 Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03” (0.8 mm ) pitch, and PBGA), fine pitch leaded parts to 12 mils, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis, system assemblies – can be provided.
Products for which EI Shenzhen can provide low-cost, high volume production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.

Once product design & development is complete and volume production is ready to begin, order placement, tracking and invoicing is all done at EI Endicott, with documentation and configuration management controlled by EI Endicott.

For more information, contact Endicott Interconnect Technologies, Inc.  1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000.  Or visit www.eitny.com.

2007 College Scholarships Awarded by Endicott Interconnect Technologies, Inc.

2007-09-11T09:54:00.000-07:00

ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) held a luncheon to honor the winners of the 2007 College Scholarship Program. Winners this year include: Daniel Longo, son of Mike and Karen Longo; Mark Poliks, son of Mark and Barbara Poliks; Konstantina Papathomas, daughter of Kostas and Athena Papathomas; Maxx Lucas, son of Brian and Maureen Lucas; and Peter Lo, son of Albert & Lizer Lo.

Winners of the $1,000 award were chosen from a very competitive field based upon their academic standing and service to the community. Applicants, who must be dependents of Endicott Interconnect, Huron Real Estate or Surescan Corp., submitted two essays, a school transcript and a listing of extra curricular activities with primary consideration being given to students pursuing engineering, business and computer science degrees. Submissions were evaluated by a panel of judges made up of Endicott Interconnect, Huron Real Estate and SureScan Corp. employees.

“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.

Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract

2007-08-23T09:55:00.000-07:00

ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) announced today that it has been awarded an initial, multi-year production contract to supply printed circuit boards to Raytheon Company’s Space and Airborne Systems. The boards are used in the Common Integrated Processor (CIP) of the F-22 Raptor.

The F-22 Raptor, utilizing stealth technology, was originally envisioned as an air superiority fighter, but is also equipped for ground attack, electronic warfare and signals intelligence roles. The CIP is the “brains” of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.

After extensive review of technologies and manufacturing capabilities, EI was selected by Raytheon’s McKinney, TX and El Segundo, CA locations. “Our continued progression of yield improvement for these products made complex by the need for dual metallurgy and the stringent requirements surrounding this specification coupled with our meeting the performance and reliability demands led to our win of this program,” stated Eric Hills, Director of Military and Defense Programs at EI.

“This is a significant win because it represents our first contract for production in the aerospace and defense segment for Raytheon. From our initial engagements, we have made the commitment to deliver unparalleled customer service and technical support providing the quality and manufacturability Raytheon requires for its products,” commented EI President and CEO, James J. McNamara. “I’m very proud of the EI team for contributing to Raytheon’s success and it’s our intention to continue doing so for many years to come.”

About Raytheon Company’s Space and Airborne Systems Space and Airborne Systems business is a $3 billion world leader in the design, development and manufacture of advanced electronic systems for precision engagement; missile defense; and intelligence, surveillance and reconnaissance applications. Key capabilities include electro-optical/infrared sensors, airborne radars, solid state high energy lasers, precision guidance systems, electronic warfare systems and space-qualified systems for civil and military applications. Headquartered in El Segundo, CA, Space and Airborne Systems has 11,000 employees and additional facilities in Goleta, CA; Forest, MS; Dallas, McKinney and Plano, TX; and several international locations.

Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification

2007-08-21T09:59:00.000-07:00

ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $19M contract modification to existing work for additional multi-chip module (MCM) assemblies and equipment in support of a high reliability, high performance computing application.

The MCM’s result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI). The assembly is then completed with the addition of a heat spreader and pin connector. A complete flip chip packaging line containing a screen printer, placement machines, a reflow oven and automated optical inspection tools was recently purchased to build these additional MCM’s.

“This contract modification win is the result of our ability to meet the performance and reliability demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.

Endicott Interconnect Technologies, Inc. Offers PCB Assembly Capability for High Volume Commercial Applications in Shenzhen, China

2007-07-12T10:00:00.000-07:00

Endicott Interconnect Technologies, Inc. (EI) announced today that they have conditionally qualified their assembly operation for high volume commercial applications located in China and are currently ramping for full production. The Company has leased 40,000 sq. ft. of production space from Lorom Industrial Co. in its Shenzhen facility and installed production equipment to support this operation.

EI will provide all materials, technical know-how and training, including work instructions, documentation and engineering support to ensure successful production start up. Lorom will be responsible for facility maintenance, production staff and general support per EI’s specifications and requirements. EI will maintain control of the design, new product introduction activity, specifications, quality requirements, sales and technical support worldwide for the products.    

“I am looking forward to a mutually beneficial partnership with Lorom. Their world-class manufacturing facilities and skilled workforce along with their continual focus on achieving the highest quality products and value-added solutions at competitive prices will greatly benefit our customers worldwide,” commented James J. McNamara Jr., President and CEO of EI.

“This agreement complements EI’s long-term manufacturing strategy of delivering high quality, cost effective products to our global customer base. By expanding our assembly offering we are able to provide a total solution, including technical support from our Endicott facility during the new product introduction phase and cost effective, high volume production capability in China,” added Wade Phelan, VP and GM, Complex Assembly Division for EI.  

 “EI’s success is admirable. After many constructive meetings with mutual trust and respect, we applaud EI for choosing to partner with Lorom in this effort. This union makes our Lorom, Shenzhen plant more valuable than ever. This agreement also offers our employees the opportunity to work with one of the preeminent manufacturing companies while delivering our customers a broad range of high quality products at competitive prices. I strongly believe this partnership will strengthen our high-tech manufacturing development and bring prosperity through a substantial increase in global market share to both companies,” stated YT Yuan, President and CEO of Lorom Industrial Co., LTD.   

About Lorom Industrial Co., LTD. 
Lorom, established in 1988, is a vertically integrated, global provider for manufacturing and development of PCB assembly, bulk cables and assemblies, power and fiber patch cords, wire harnesses, adapters and terminators and value added solutions. Headquartered in Taipei, Taiwan, Lorom has a worldwide sales presence and state-of-the-art manufacturing capability in Taiwan and mainland China. For more information about Lorom, please visit www.lorom.com

Baker Announces Equipment Sales to Endicott Interconnect Technologies

2007-06-07T10:04:00.000-07:00

M.E. Baker Company's MEI Division today announced the sale of multiple wet process tools to Endicott Interconnect Technologies' (EI). These innovative develop, etch, and strip tools are designed for processing flexible material in discrete and roll form. These tools will be used in the CAMM consortium enhancing set of the tools to have the new generation of R2R processing.

 CAMM was established in 2005 when the United States Display Consortium (USDC) selected Binghamton University, EI and Cornell to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry, and academia to tackle the myriad challenges of this emergent technology. In addition to EI , Binghamton University and Cornell, members of CAMM include but are not limited to NASA and USDC, GE, Kodak, and Corning, and Arizona State Universities.  Baker is a world leader in the design and manufacture of wet process equipment for a variety of industries including electronics, medical, automotive, defense & aerospace, and consumer products.

Baker's MEI Division offers fully integrated R2R solutions to the printed circuit board and microelectronics industries. With representation in Asia by WKK Distribution, Baker is uniquely positioned to bring R2R solutions from lab scale to high production manufacturing environment.  More information can be found on CAMM's website at camm.binghamton.edu, EI's website at endicottinterconnect.com, or Baker's website at mebaker.com

Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract

2007-05-29T10:06:00.000-07:00

Endicott, NY― Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing. EI has successfully met the stringent DoD qualification requirements for its PCB, module and processing blade production.

This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.

Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.

“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”

“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”

Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies

2007-05-24T10:07:00.000-07:00

Billerica, MA – Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.

EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.

“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI.  “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.

Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”

HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated Thru-Holes for Increased Circuit Density

2007-05-21T10:10:00.001-07:00

Endicott, NY -- Having to drill plated-thru-holes (PTHs) to make signal connections within printed circuit boards (PCBs) may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies (EI). New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.

The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.

“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for  mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”

HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.

“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”

For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.

Thin Core Flip Chip Package Provides 199 Micron Via-to-Via Core Pitch

2007-04-07T10:11:00.000-07:00

The CoreEZ™ semiconductor package developed by Endicott Interconnect Technologies utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core.   

CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.   

Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.

Applications 
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.

About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.

For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.

Endicott Interconnect Technologies, Inc. Appoints Director of Engineering

2007-04-04T10:13:00.000-07:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.

Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.

“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”

Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.

Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M

2007-03-23T10:16:00.000-07:00

ENDICOTT, NY -- The U.S. Department of Defense has awarded  Endicott Interconnect Technologies, Inc. multiple contracts totaling $164M to produce card frame assemblies including organic semiconductor packaging, module assemblies, printed circuit boards, full functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. EI also provided an innovative and cost effective logistics, shipping and storage solution to the DoD customer in support of this important endeavor.

EI initially recommended its HyperBGA® organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.

Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.

Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.

“Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business,” said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid,” he continued.

“It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs,” stated the DoD customer.

“The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer’s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the  ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements,” commented James J. McNamara, President and CEO at EI. “And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof.”

Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development

2007-03-13T10:17:00.000-07:00

Endicott Interconnect Technologies, Inc. has announced the appointment of Rajinder Rai as Vice President, Research & Development reporting to Voya Markovich, effective immediately. He will assume responsibility for the management of resources and support functions for current and future R&D activities in response to business opportunities with state and federal program agencies.

Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.

Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.

“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”

Technology Neighbors Announce Process Development and Manufacturing Partnership for Medical Application Using World’s Finest Pitch Soldered Flip Chip

2007-02-22T10:19:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, through their partnership with Unovis-Solutions, announced today that they have entered into a Manufacturing Services Agreement with a leading manufacturer of intravascular ultrasound (IVUS) catheters. Under terms of the Agreement, EI will develop and manufacture a state-of-the-art flexible substrate or circuit and assemble flip chip components to it per the manufacturer’s specifications. EI will procure materials and fixtures to be used in the flexible substrate fabrication and assembly process. The device manufacturer will be responsible for purchasing minimum quantities of the flexible circuit assembly over a 2-year period totaling $3.9 million.

This unique assembly is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. Assembled to this flexible substrate is a PZT (receiver/transmitter) and multiple flip chip die with 22 micron bumps on 70 micron pitch. These are some of the finest pitched, soldered interconnect flip chips in production anywhere in the world today. This distinctive assembly becomes part of an IVUS catheter device, which provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease.

“This opportunity came solely from our relationship with our innovative neighbors up the street, Unovis-Solutions,” stated James J. McNamara, President and CEO at EI. “Their Advanced Process Lab developed and automated critical manufacturing processes for this cutting edge, medical technology. Unovis-Solutions then recommended EI to the end customer for manufacture of the flip-chip assembly and provided us with complete process and equipment implementation guidelines to build the product in volume,” he continued.

EI in turn purchased a GSMxs flip chip placement system from Unovis-Solutions, because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. This advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.

“We recommended EI to partner with us in this endeavor because of their unique substrate development and manufacturing capabilities and their highly skilled teams’ ability to tackle manufacturing challenges that result in excellent quality, high performance solutions,” said George Westby, Director Advanced Process Laboratory at Unovis-Solutions.    “EI and Universal Instruments Corporation, and now Unovis-Solutions, have collaborated on many programs. We utilize Universal’s GSM, Genesis™ and AdVantis™ platform systems in multiple lines throughout the plant and have served as a beta site facility for some of their products as well,” commented Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Unovis brings expertise in materials and assembly process development that provides innovative solutions needed to address our unique production demands. Together with Unovis as our partner, we will continue to solve some of the industry’s toughest process and assembly challenges.”

About Unovis-Solutions Unovis-Solutions enables its customers to succeed in the marketplace by partnering throughout all steps of the product life cycle. Customers benefit from Unovis' in-depth knowledge and expertise in electronics assembly, improving speed-to-market, scalability and competitiveness. Unovis offers a broad range of state-of-the-art manufacturing solutions including but not limited to component and die processing, odd form and final assembly, transport systems, flexible process cells and peripherals, and advanced process services and applied research. Established in July 2006 as a strategic merger of four divisions of Universal Instruments and Hover-Davis, Unovis effectively leverages the core competencies and the synergy between these companies. The firm draws on extensive systems integration experience and long-established relationships with third-party sub-system, equipment and process partners. Roland Heitmann, former General Manager of the Hover-Davis Direct Products Division leads the Unovis team.

Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair

2007-01-31T10:22:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced a job fair scheduled for Saturday, February 3rd from 9am to 1pm at Huron Campus Reception in Endicott, NY. Professional, full-time manufacturing and supplemental manufacturing opportunities are available.

“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.

EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.

Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.

Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure

2007-01-03T08:38:00.000-08:00

Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.

Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.

Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.

“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.

Warren is based in Louisville, Kentucky where he lives with his wife and two children.

Endicott Interconnect Technologies Places Multiple-System Order for ESI UV Laser Drilling Systems

2006-12-19T10:25:00.000-08:00

PORTLAND, Ore.-- Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class production laser systems for microengineering applications, today announced that Endicott Interconnect Technologies, Inc. (EI) -- a leading New York-based interconnect supplier -- has placed a follow-on, multiple-system order for ESI's ultraviolet (UV) laser drilling systems. A longtime ESI customer, EI will utilize ESI's single-head and dual-head systems to optimize volume manufacturing of its high-performance application-specific integrated circuits (ASICs).

"ESI's UV laser drilling systems deliver enhanced reliability and throughput for our high-volume manufacturing requirements, providing a competitive advantage that we can pass onto our customers," said Mr. Jim Fuller, VP and GM, Semiconductor Packaging of EI. "As a result, ESI is our preferred provider for this essential technology. We have experienced excellent performance from our existing ESI UV laser tools, and are confident these new systems will continue to raise the bar on speed and accuracy."

"The follow-on, multi-system order demonstrates EI's commitment to ESI, and further solidifies our position as the industry's premier supplier of UV laser drilling tools that can meet customers' most aggressive technology requirements," noted Sidney Wong, senior director of product market solutions at ESI. "We look forward to extending our long-term relationship with EI as we continue developing new solutions that enable our global customers to meet their advanced product and technology roadmaps."

ESI's high-repetition UV laser drilling systems perform high-quality, high-volume drilling of blind microvias in advanced IC packages, such as flexible circuits and high-density interconnect (HDI). Key demand drivers of ESI's interconnect products include its ultra-high speed digital beam positioning module and its enhanced pulse rate for via formation. The single-head shaped beam produces more than 25,000 high-quality microvias per minute on advanced IC packages. By contrast, the dual-head shaped beam system can produce more than 60,000 vias per minute in multi-layer laminated materials up to 533 mm x 635 mm.

About ESI, Inc.
ESI is a pioneer and leading supplier of world-class production laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors -- semiconductors, components and electronic interconnect -- by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.

Technological Leadership Continues to Differentiate Endicott Interconnect

2006-11-28T10:26:00.000-08:00

ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. recently celebrated the issuance of its 27th U.S. Patent since becoming an independent company just four years ago. EI, which ranks 13th among the top U.S. PCB companies in revenues (Printed Circuit Design & Manufacture, September, 2006), is led by only three of those companies in PCB related issued patents. The firm’s impressive patent portfolio covers innovative substrate designs and manufacturing processes and is strong evidence of EI’s technical expertise in this very competitive area. Already, EI owns more issued U.S. Patents relating to PCB’s than many of its main competitors.

EI’s expertise in electronic packaging substrates stems from the know-how of innovative technologists. The company’s heritage has provided a long history of technological advancements that continues today with EI’s top 11 patent holders accounting for over 700 patents combined. They include; Voya Markovich (171), Kostas Papathomas (154), John Lauffer (83), Robert Japp (59), Frank Egitto (55), Luis Matienzo (49), James Wilson (40), Thomas Miller (33), Benson Chan (32), John Kresge (32) and Mark Poliks (32).

“EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. This technical leadership has been accomplished through the creativity and invention of our talented personnel,” commented James J. McNamara, President and CEO at EI. “This innovation is a key to EI’s success in the advanced packaging arena and clearly differentiates us from our competitors,” he continued.

Technical leadership is further exemplified by EI technologists through collaboration with universities, consortia and leadership roles within industry organizations. How Lin serves as an Adjunct Professor at Binghamton University and Jeff Knight is the Advanced Packaging Committee Chair for the Electronic Components and Technology Conference (ECTC).

Voya Markovich is Chair of the Interconnect Section for the Electronic Components and Technology Conference (ECTC), President of the International Microelectronics and Packaging Society (IMAPS) New Jersey Chapter, and a member of the industrial and executive boards for the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM) and the Watson School of Engineering and Applied Science at Binghamton University.

Mark Poliks is the Electronic Components and Technology Conference (ECTC) Materials/Processing Section Co-Chair, a Research Professor at Binghamton University, Northeast Regional Program Chair for the American Chemical Society, Advisory Board Member of the Integrated Electronics Engineering Center (IEEC) and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM).

Additionally, EI technologists including Benson Chan, Frank Egitto, Mark Poliks, Roy Magnuson, Mike Rowlands, Luis Matienzo, How Lin and Vara Calmidi recently taught a course in Flexible Electronics at Cornell University.

EI's Markovich Receives the Northeast Regional Industrial Innovation Award

2006-10-12T10:28:00.000-07:00

ENDICOTT, NY -- Voya R. Markovich was selected by the American Chemical Society (ACS) to receive this year's Northeast Regional Industrial Innovation Award. The awards ceremony, held in conjunction with the 34th Northeast Regional Meeting of the ACS, took place on Friday, October 6th at the Holiday Inn Arena in Binghamton, New York.   

This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems.   Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.

  "Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors," commented James J. McNamara, President and CEO at EI. "We are proud of Voya's accomplishments and thank him for his many innovations that have contributed to EI's success," he continued.

EI at IPC Printed Circuits Expo, APEX and the Designers Summit 2006

2006-01-03T08:36:00.000-08:00

Endicott Interconnect Technologies, Inc., will use the IPC Printed Circuits Expo, APEX and the Designers Summit to showcase its printed circuit board fabrication, advanced electronic semiconductor packaging and 2nd level packaging solutions.

Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.

EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.

EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.

IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.

Endicott Interconnect Announces Role in Center for Advanced Microelectronics Manufacturing

2005-12-24T08:35:00.000-08:00

The United States Display Consortium (USDC) announced today that it had awarded a contract for the creation of a Center for Advanced Microelectronics Manufacturing (CAMM) to a team consisting of Binghamton University, Cornell University and Endicott Interconnect Technologies.

The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center.  The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center.  The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.

Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."

Endicott Interconnect Technologies Announces $10 Million Capital Expansion

2004-06-17T08:32:00.000-07:00

Endicott Interconnect Technologies today announced a $10 Million capital expansion program to meet robust demand in all of its products. "Endicott Interconnect's printed circuit board, semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," says Jim Herard, Marketing Manager for Endicott Interconnect.   

The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.

 Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.

  "I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.