Our clients are sold on our excellence as soon as they tour our campus. They’re like you: They need the most reliable, highest quality product available. They understand that comes from the best processes. They like the one stop shop that means they don’t have to juggle personnel or suffer delays trying to coordinate multiple service vendors.
They want the quick response and personal service from a team of experts that has decades of experience and can understand your needs and translate them into a test methodology. Our U.S. based, state-of-the-art facility offers full services testing and analysis with strict adherence to your standards and specifications.
We specialize in:
• Technology and product reliability qualifications
• Materials and failure analysis
• Reliability engineering
• Mechanical and fragility testing
• Thermal and mechanical modeling
• Product qualifications to customer specs
What sets Endicott Interconnect Advanced Lab Services apart?
• Experience-Average 20+ years experience with microelectronics reliability and materials analysis
• Expertise-Mechanisms and failure modes, material behaviors and interactions in microelectronics packaging
• Unique Approach-Collaborate with the customer to get a deeper understanding of the issue; working from problems to techniques
• Solutions-Not just data but interpretation of results and the impacts to your product or process
• Flexibility-Quick turn analysis available
What some of the world’s top microelectronics companies are saying about EI:
• “They find the fails others cannot.”
• “They are proven experts in CAF testing, failure analysis, and life testing.”
• “They don’t blindly accept a test plan, they enhance it.”
• “They speak my language.”
Endicott Interconnect’s Advanced Lab Services offer a powerful combination of people, equipment and expertise, adding in-sight and value to product life designs, technology testing and qualification plans. Our extensive experience in microelectronics manufacturing, fabrication and assembly enable us to provide you with unmatched, world-class data analysis.
Experience the power of EI. Visit our Advanced Lab Services webpage or fill out a contact us form and let EI handle your entire laboratory needs.
Tuesday, April 10, 2012
Friday, March 23, 2012
Endicott Interconnect Appoints New Chief Financial Officer
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has appointed David W. Van Rossum to the position of Chief Financial Officer effective immediately. In this role, Mr. Van Rossum is responsible for the financial plans and policies of the company including establishing and maintaining fiscal controls; preparing and interpreting financial reports; ensuring financial resources are available to meet strategic objectives and safeguarding company assets.
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. “David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident he will make a significant contribution in this complex environment.”
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor’s of Science in Business Administration from New Hampshire University
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. “David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident he will make a significant contribution in this complex environment.”
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor’s of Science in Business Administration from New Hampshire University
Tuesday, March 20, 2012
Endicott Interconnect Printed Circuit Board Build Highlights
We will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build. Here is our first highlight:
5mil Stacked or unstacked microvias unbreakable through 250 cycles!
Stack up Report
- 20 layers
- 9.2 x 6.6“
- 86 mils thick
- Tolerance: +8.6/-8.6 mils
- Material: Megtron 6
- ENIG surface finish
- 12 layer core with mechanically drilled through holes
- 4 layers of microvias on each side of the core
- Laser drilled and copper plated uvias
- Via structures tested using CITC testing (Current Induced Thermal Cycling)
- CITC conducted from room temperature to 220 C
5mil Stacked or unstacked microvias unbreakable through 250 cycles!
Stack up ReportFor more information on our PCB capabilities follow this link. If you have any questions fill out our contact us form.
Monday, March 12, 2012
Benefits of Utilizing System-in-Package (SiP)
Reductions in Size & Weight- Utilization of System-in-Package technologies can reduce the complexity of PCB’s and often times eliminate them entirely. In many instances surface mounted capacitors, resistors, and other electronic components can be embedded right into the substrate, which can potentially lead to a 24x system size reduction. The miniaturization and embedding of components that System-in-Package provides will greatly reduce the size and weight of the application.
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Friday, March 2, 2012
EI's Dr. Mark Poliks' Interview With "Real Time With IPC"
Dr. Mark Poliks, director or Research & Development at Endicott Interconnect Technologies, describes some of the current and emerging capabilities for high-density and high-performance electronic interconnection products that are, or will soon be, available at EI.
Watch the video here
Watch the video here
Wednesday, February 15, 2012
Cambridge Who's Who Names Annamaria Mastronardi Professional of the Year in Human Resources
ENDICOTT, NY, -- Annamaria Mastronardi, Director of Human Resources for Endicott Interconnect Technologies, has been named a Cambridge Who's Who Professional of the Year in Human Resources. While inclusion in the Cambridge Who's Who Registry is an honor, only a small selection of members in each discipline are chosen for this distinction. These special honorees are distinguished based on their professional accomplishments, academic achievements, leadership abilities, years of service, and the credentials they have provided in association with their Cambridge Who's Who membership.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
Tuesday, February 7, 2012
Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel
ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
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