ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has appointed David W. Van Rossum to the position of Chief Financial Officer effective immediately. In this role, Mr. Van Rossum is responsible for the financial plans and policies of the company including establishing and maintaining fiscal controls; preparing and interpreting financial reports; ensuring financial resources are available to meet strategic objectives and safeguarding company assets.
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. “David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident he will make a significant contribution in this complex environment.”
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor’s of Science in Business Administration from New Hampshire University
Showing posts with label Press Releases. Show all posts
Showing posts with label Press Releases. Show all posts
Friday, March 23, 2012
Wednesday, February 15, 2012
Cambridge Who's Who Names Annamaria Mastronardi Professional of the Year in Human Resources
ENDICOTT, NY, -- Annamaria Mastronardi, Director of Human Resources for Endicott Interconnect Technologies, has been named a Cambridge Who's Who Professional of the Year in Human Resources. While inclusion in the Cambridge Who's Who Registry is an honor, only a small selection of members in each discipline are chosen for this distinction. These special honorees are distinguished based on their professional accomplishments, academic achievements, leadership abilities, years of service, and the credentials they have provided in association with their Cambridge Who's Who membership.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
Tuesday, February 7, 2012
Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel
ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
Thursday, January 26, 2012
Endicott Interconnect Technologies, Inc. Announces the Launch of Their New Website
Over the past several months Endicott Interconnect has been working hand-in-hand with web developers, Vibrant Creative, to upgrade and revitalize their web presence.
The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.
To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.
The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.
To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.
Wednesday, January 18, 2012
Endicott Interconnect Technologies, Inc. Honors Employees at Eighth Annual Patent Award and Trade Secret Dinner
ENDICOTT, NY—Endicott Interconnect Technologies, Inc. (EI) honored 23 employees for patent applications filed, U.S. patents issued and trade secrets received in 2010 at an awards dinner and ceremony held Friday, January 13th 2012 at De Gennaro’s in Endicott, N.Y.
Awards were presented to: Dave Alcoe, Ash Bhatt, Kim Blackwell, Barry Bonitz, Benson Chan, Rabindra Das, Frank Egitto, Mike Hills, John Lauffer, How Lin, Roy Magnuson, Jay McNamara, Frank Marconi, Voya Markovich, Luis Matienzo, Tom Miller, Kostas Papathomas, Mark Poliks, Steve Rosser, Duane Stanke, Bob Testa, Bill Wilson, and Michael Wozniak.
“I am very proud of these individuals whose bold invention, creativity and technological innovation has contributed to the success of EI, ensuring our technical vitality and competitiveness in the open market. The hard work of those being honored tonight is a testament to the truly great things being developed by Endicott Interconnect,” commented James McNamara, President and CEO at EI.
Currently, Endicott Interconnect holds 129 U.S. patents and 32 Trade Secrets.
Tuesday, December 16, 2008
Endicott Interconnect Technologies, Inc. Achieves AS9100 Aerospace Certification with 100% Score
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded certification to the AS9100 Quality Management Standard for aerospace suppliers. This certification signifies that its Endicott, N.Y. facility complies with all requirements of the AS9100 quality management system which covers quality assurance in design, development, production, installation and servicing, as well as purchasing, validation and shipping. The standard includes all ISO 9001:2000 requirements and is expanded to address needs specific to the international aerospace industry.
“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”
Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.
AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.
“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”
Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.
AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.
Thursday, December 4, 2008
Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
Friday, October 24, 2008
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Thursday, September 18, 2008
Endicott Interconnect Technologies Prepares For Significant Growth, Modifies Employment Practices and Schedules Job Fair
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has scheduled a job fair for Thursday, September 25th from 4pm to 7pm at EI in Endicott, NY. The company is looking to add over 150 employees during the fourth quarter of 2008. Professional and full-time manufacturing positions are available.
In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.
These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.
EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.
EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.
In addition, EI is modifying its employment practices to reflect the Company’s stable economic position and need for an expanding workforce. Effective immediately, the use of “temporary” labor will be restricted to those jobs that are for a pre-defined period. All other hiring will be for regular, full-time employment including the full suite of benefits. In conjunction with this change, EI will convert qualified employees currently classified as “temporary” to full-time, permanent status, making many of these employees eligible for participation in the 2008 Corporate Cash Profit Sharing Program.
These changes in our employment practices and need for additional positions result from increased demand in the defense and high end computing markets for printed circuit board fabrication and assembly operations,” stated Felicia Williams, VP of Human Resources at EI.
EI’s strong finish in 2007 resulted in a 73% increase in revenue over the previous year, and the Company is experiencing another year of significant revenue increases in 2008. The firm has added 300 plus jobs and spent over $28M in the past three years for capital equipment to add the capacity necessary to meet growing customer demand. The firm has also been awarded 58 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception six years ago.
EI’s Human Resource offices are situated on the Huron Campus and are located on Heritage Circle, off North Street in Endicott, N.Y. The Company is also accepting resumes and walk-in applicants, scheduling interviews and extending offers prior to the job fair.
Tuesday, August 19, 2008
Felicia Williams Named Vice President of Human Resources at Endicott Interconnect Technologies, Inc.
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has named Felicia Williams to the position of Vice President of Human Resources effective immediately. In this role, Ms. Williams is responsible for leading EI’s human resource programs, including evaluating and determining needs and opportunities, assessing the effectiveness of existing structures and programs and determining strategic goals and implementation plans.
Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward. “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”
Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.
Ms. Williams has more than 20 years experience in human resources administration and management. For the past 15 years, she has held a variety of leadership roles within the human resource organization of Arrow Electronics, Inc., most recently as Vice President of Human Resources for North American Global Components. Her expertise in performance management and development, organization design, change leadership, strategic staffing and mergers and acquisitions support EI’s strategies moving forward. “Felicia’s broad and diverse HR experience will bring much added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident she will make a significant contribution in this complex environment.”
Ms. Williams holds a Bachelor’s of Business Administration degree from Illinois Institute of Technology, and is Green Belt certified.
Tuesday, July 29, 2008
Endicott Interconnect Technologies, Inc. Announces 2008 Scholarship Award Winners
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2008 scholarship program in a breakfast ceremony held at EI on Friday, July 25th. 2008 winners include: Renee Stanke, daughter of Duane and Linda Stanke, who will be attending Broome Community College; Melissa Bates, daughter of Bernita Bates, who will be attending Syracuse University; Richard Hill, son of Richard and Sharon Hill, who will be attending SUNY Stony Brook; Bryan Simpson, son of Dave and Susan Seibold-Simpson, who will be attending Binghamton University; and Amir Merke, son of Tensaew Ashera, who will also be attending Binghamton University.
Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
Recipients are dependents of EI employees who are continuing their education and were selected for the $1,500 award based on their academic excellence and community service. Submissions were evaluated by a panel of judges made up of EI employees.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara, President and CEO at EI. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
Wednesday, July 23, 2008
Endicott Interconnect Technologies, Inc. Receives Good Neighbor Award
ENDICOTT, NY ― Endicott Interconnect Technologies, Inc. (EI) received the Good Neighbor Award for outstanding support to the American Red Cross Southern Tier Chapter, at a ceremony held at Genegantslet Golf Club on June 26th, 2008.
This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.
“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.
This award is presented to an individual or organization for having made a significant humanitarian contribution to local, national or the international community in support of the Red Cross.
“The Red Cross Southern Tier Chapter strengthens our community with their preparedness, prevention and response to emergencies of all kinds. EI is pleased to contribute financially and applauds our employees who donate at our regularly scheduled blood drives throughout the year,” commented James McNamara, President and CEO at EI.
Tuesday, July 1, 2008
Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award
Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region. The award, which recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses, was presented at a gala event on June 27th held at the Carnegie Music Hall and Foyer in Pittsburgh, P.A.
McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.
“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”
Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.
About Ernst & Young’s Entrepreneur Of The Year
Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.
About Ernst & Young
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.
McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.
“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”
Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.
About Ernst & Young’s Entrepreneur Of The Year
Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.
About Ernst & Young
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.
Friday, June 27, 2008
ndicott Interconnect Technologies, Inc. Supports the Boy Scouts
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) donated $5,000.00 to the Baden-Powell Council, Boy Scouts of America, in support of an Aquatics Education structure to be built at Camp Tuscarora in Windsor, N.Y. The building will be the centerpiece of the waterfront at the camp and utilized for aquatics training including swimming, boating and fishing. The Baden-Powell Council serves communities in Broome, Chenango, Cortland, southern Seneca, Tioga and Tompkins Counties of New York and Susquehanna County of Pennsylvania.
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
Tuesday, June 17, 2008
Voya R. Markovich named an honored member in technology by Princeton Premier
New York, N.Y. -- Voya R. Markovich, senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., has been chosen for inclusion in the 2008-2009 Princeton Premier Registry.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Wednesday, May 28, 2008
Endicott Interconnect Technologies Hosts IPC Technology Interchange Event
ENDICOTT, N.Y.― Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled “Will You Be Ready?: An Endicott Technology Interchange” on Wednesday, May 14th, 2008. The event took place at the Company’s headquarters in Endicott, N.Y. and included a tour of the facility, presentations from EI’s top technologists and a panel discussion featuring leading industry suppliers.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Tuesday, May 6, 2008
Department of Defense Awards Endicott Interconnect Technologies $148.6M Contract Modification
ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. This contract modification period of performance is May, 2008 to December, 2008.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
Friday, February 22, 2008
Endicott Interconnect Technologies, Inc. Expands with UK Office and Appoints European Sales Director
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) announced today that it has created EI Technologies UK Limited, a wholly owned subsidiary of EI and located in Chelmsford, UK. Steve Payne has been named Director of European Sales reporting to Michael Hills, SVP of Sales, Marketing and Business Development at EI, effective immediately.
Steve will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Steve is also tasked with account penetration of segments targeted for future growth in the European marketplace.
With over 30 years experience in the global electronic packaging industry, Steve brings solid technical knowledge as well as a keen understanding of European business cultures. He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology, Ltd. Steve’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.
"We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” commented Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”
Steve will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Steve is also tasked with account penetration of segments targeted for future growth in the European marketplace.
With over 30 years experience in the global electronic packaging industry, Steve brings solid technical knowledge as well as a keen understanding of European business cultures. He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology, Ltd. Steve’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.
"We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” commented Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”
Monday, November 12, 2007
Endicott Interconnect Technologies (EI) Buys 4 More Schmoll Machines
Garden Grove, CA -- Dave Howard, Vice President and COO for Burkle North America's FabFour Group, announced today that Endicott Interconnect Technologies has placed an order for another four (4) MX-1 XXL advanced high speed drilling machines from Schmoll Maschinen (Germany). They have again chosen a mix of single station single head machines and also single station dual head machines (one drilling and one routing) with the added option of vision. EI now has a total of 8 units from Schmoll.
Schmoll, located near Frankfurt, Germany is part of Burkle's FabFour Machinery Alliance consisting of Burkle Lamination and Coating Systems, Posalux high volume drilling and routing systems, Bacher Registration and Exposure Systems and LHMT Scoring and Beveling equipment.
For more information, contact Dave Howard, at 714-379-5090, or visit Burkle North America's Web Site at www.burkleusa.com.
Schmoll, located near Frankfurt, Germany is part of Burkle's FabFour Machinery Alliance consisting of Burkle Lamination and Coating Systems, Posalux high volume drilling and routing systems, Bacher Registration and Exposure Systems and LHMT Scoring and Beveling equipment.
For more information, contact Dave Howard, at 714-379-5090, or visit Burkle North America's Web Site at www.burkleusa.com.
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