Our clients are sold on our excellence as soon as they tour our campus. They’re like you: They need the most reliable, highest quality product available. They understand that comes from the best processes. They like the one stop shop that means they don’t have to juggle personnel or suffer delays trying to coordinate multiple service vendors.
They want the quick response and personal service from a team of experts that has decades of experience and can understand your needs and translate them into a test methodology. Our U.S. based, state-of-the-art facility offers full services testing and analysis with strict adherence to your standards and specifications.
We specialize in:
• Technology and product reliability qualifications
• Materials and failure analysis
• Reliability engineering
• Mechanical and fragility testing
• Thermal and mechanical modeling
• Product qualifications to customer specs
What sets Endicott Interconnect Advanced Lab Services apart?
• Experience-Average 20+ years experience with microelectronics reliability and materials analysis
• Expertise-Mechanisms and failure modes, material behaviors and interactions in microelectronics packaging
• Unique Approach-Collaborate with the customer to get a deeper understanding of the issue; working from problems to techniques
• Solutions-Not just data but interpretation of results and the impacts to your product or process
• Flexibility-Quick turn analysis available
What some of the world’s top microelectronics companies are saying about EI:
• “They find the fails others cannot.”
• “They are proven experts in CAF testing, failure analysis, and life testing.”
• “They don’t blindly accept a test plan, they enhance it.”
• “They speak my language.”
Endicott Interconnect’s Advanced Lab Services offer a powerful combination of people, equipment and expertise, adding in-sight and value to product life designs, technology testing and qualification plans. Our extensive experience in microelectronics manufacturing, fabrication and assembly enable us to provide you with unmatched, world-class data analysis.
Experience the power of EI. Visit our Advanced Lab Services webpage or fill out a contact us form and let EI handle your entire laboratory needs.
Showing posts with label Miscellaneous. Show all posts
Showing posts with label Miscellaneous. Show all posts
Tuesday, April 10, 2012
Monday, March 12, 2012
Benefits of Utilizing System-in-Package (SiP)
Reductions in Size & Weight- Utilization of System-in-Package technologies can reduce the complexity of PCB’s and often times eliminate them entirely. In many instances surface mounted capacitors, resistors, and other electronic components can be embedded right into the substrate, which can potentially lead to a 24x system size reduction. The miniaturization and embedding of components that System-in-Package provides will greatly reduce the size and weight of the application.
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Friday, March 2, 2012
EI's Dr. Mark Poliks' Interview With "Real Time With IPC"
Dr. Mark Poliks, director or Research & Development at Endicott Interconnect Technologies, describes some of the current and emerging capabilities for high-density and high-performance electronic interconnection products that are, or will soon be, available at EI.
Watch the video here
Watch the video here
Monday, January 30, 2012
What's New About the EI Website?
EI has been in business for almost 10 years, has expanded into many new markets and has created products for hundreds of new customers. Unfortunately, our old website did not have the functionality or capability to adequately reflect these changes in our growing business. We decided to make significant improvements to our web presence in late 2011 when we partnered with Vibrant Creative to completely redesign and revamp our website. Below are the top 5 major areas of the website that we felt would create a more fluid and informative experience for our customers, suppliers and employees. The proceeding information will also act as a tool to help guide you, the visitor, through the new website to ensure that your time spent on the EI site is engaging as well as enjoyable.
New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.
Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.
Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.
Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.
Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.
New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.
Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.
Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.
Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.
Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.
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