Our clients are sold on our excellence as soon as they tour our campus. They’re like you: They need the most reliable, highest quality product available. They understand that comes from the best processes. They like the one stop shop that means they don’t have to juggle personnel or suffer delays trying to coordinate multiple service vendors.
They want the quick response and personal service from a team of experts that has decades of experience and can understand your needs and translate them into a test methodology. Our U.S. based, state-of-the-art facility offers full services testing and analysis with strict adherence to your standards and specifications.
We specialize in:
• Technology and product reliability qualifications
• Materials and failure analysis
• Reliability engineering
• Mechanical and fragility testing
• Thermal and mechanical modeling
• Product qualifications to customer specs
What sets Endicott Interconnect Advanced Lab Services apart?
• Experience-Average 20+ years experience with microelectronics reliability and materials analysis
• Expertise-Mechanisms and failure modes, material behaviors and interactions in microelectronics packaging
• Unique Approach-Collaborate with the customer to get a deeper understanding of the issue; working from problems to techniques
• Solutions-Not just data but interpretation of results and the impacts to your product or process
• Flexibility-Quick turn analysis available
What some of the world’s top microelectronics companies are saying about EI:
• “They find the fails others cannot.”
• “They are proven experts in CAF testing, failure analysis, and life testing.”
• “They don’t blindly accept a test plan, they enhance it.”
• “They speak my language.”
Endicott Interconnect’s Advanced Lab Services offer a powerful combination of people, equipment and expertise, adding in-sight and value to product life designs, technology testing and qualification plans. Our extensive experience in microelectronics manufacturing, fabrication and assembly enable us to provide you with unmatched, world-class data analysis.
Experience the power of EI. Visit our Advanced Lab Services webpage or fill out a contact us form and let EI handle your entire laboratory needs.
Tuesday, April 10, 2012
Friday, March 23, 2012
Endicott Interconnect Appoints New Chief Financial Officer
ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI) has appointed David W. Van Rossum to the position of Chief Financial Officer effective immediately. In this role, Mr. Van Rossum is responsible for the financial plans and policies of the company including establishing and maintaining fiscal controls; preparing and interpreting financial reports; ensuring financial resources are available to meet strategic objectives and safeguarding company assets.
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. “David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident he will make a significant contribution in this complex environment.”
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor’s of Science in Business Administration from New Hampshire University
Mr. Van Rossum spent 20 years with Tyco International and was VP/CFO of Tyco Telecomm from 1997-2002. More recently, David was CFO at Russound as their Chief Financial Officer and Chief Operations Officer (COO) and is currently on the Board of Directors at Service Credit Union. Most of his financial experience has been in high tech manufacturing and in Government contracts. “David’s broad and diverse financial and leadership experience will bring added value to the company as we continue to focus the organization on growth and operational excellence,” said James J. McNamara, president and CEO at EI. “I am confident he will make a significant contribution in this complex environment.”
David earned his Masters of Business Administration from the University of Southern New Hampshire. He also possesses a Bachelor’s of Science in Business Administration from New Hampshire University
Tuesday, March 20, 2012
Endicott Interconnect Printed Circuit Board Build Highlights
We will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build. Here is our first highlight:
5mil Stacked or unstacked microvias unbreakable through 250 cycles!
Stack up Report
- 20 layers
- 9.2 x 6.6“
- 86 mils thick
- Tolerance: +8.6/-8.6 mils
- Material: Megtron 6
- ENIG surface finish
- 12 layer core with mechanically drilled through holes
- 4 layers of microvias on each side of the core
- Laser drilled and copper plated uvias
- Via structures tested using CITC testing (Current Induced Thermal Cycling)
- CITC conducted from room temperature to 220 C
5mil Stacked or unstacked microvias unbreakable through 250 cycles!
Stack up ReportFor more information on our PCB capabilities follow this link. If you have any questions fill out our contact us form.
Monday, March 12, 2012
Benefits of Utilizing System-in-Package (SiP)
Reductions in Size & Weight- Utilization of System-in-Package technologies can reduce the complexity of PCB’s and often times eliminate them entirely. In many instances surface mounted capacitors, resistors, and other electronic components can be embedded right into the substrate, which can potentially lead to a 24x system size reduction. The miniaturization and embedding of components that System-in-Package provides will greatly reduce the size and weight of the application.
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Cost Savings-Individual die are attached (Wirebond, Flip Chip or combinations of both) directly to the SiP substrate not only saving space but individual die packaging costs. By placing functions that were once on larger printed circuit board assemblies, significant size and weight savings are achieved - which directly correlates to the cost of weight-to-function calculations. In other words multiple functions can be combined into a smaller total space allowing more capability and achieving a higher value per unit of area or volume.
Flexibility-System-in-Package applications can be applied to almost any market whether it be Aerospace & Defense, Medical, Industrial, Automotive, Telecommunications, or Computing. Not only is the concept of SiP applicable to different markets, it's also flexible in design. We have manufactured SiP substrates & assemblies in many different shapes, sizes & configurations including adding a flex circuit connection between multiple assembled functional SiP modules to produce a completely reconfigured product.
Future of Electronics-The need for functions that were once unachievable due to the size or weight of the assembled electronics package can now be rethought. Whether it be in delicate and size sensitive Medical applications, weight-to-function restrictive Aerospace and Defense applications, or even to satisfy a multitude of new Industrial needs.
So why chose EI for System-in-Package?
EI’s high reliability, superior electrical performance, reputation as a trusted supplier, and competitive offerings and roadmaps, make it an ideal company to handle all of your System-in-Package needs. EI is the most experienced US merchant supplier of microelectronics packaging assembly. We’ve placed over a half million die and 1.4 billion flip chip connects in the field with zero returns, which demonstrates EI’s dedication to quality.
Our organic substrates enable more functionality in smaller packages, can be designed to support RF signal speeds approaching 40 GHz, support FPGA, ASIC, microprocessors and memory, can improve electrical performance through reductions in trace length and EI offers custom body sizes and shapes to fit most applications
EI’s SiP capabilities can be used in a variety of different fields including Medical, Aerospace and Defense, Communications and Computing, Detection and Imaging, as well as Semiconductor Packaging.
The power of our solutions lies in our ability to provide you with a breadth of products and services all under one roof.
Interested in EI’s System-in-Package capabilities? Click here to check out our website or fill out a contact form.
* Dependent on component availability
Friday, March 2, 2012
EI's Dr. Mark Poliks' Interview With "Real Time With IPC"
Dr. Mark Poliks, director or Research & Development at Endicott Interconnect Technologies, describes some of the current and emerging capabilities for high-density and high-performance electronic interconnection products that are, or will soon be, available at EI.
Watch the video here
Watch the video here
Wednesday, February 15, 2012
Cambridge Who's Who Names Annamaria Mastronardi Professional of the Year in Human Resources
ENDICOTT, NY, -- Annamaria Mastronardi, Director of Human Resources for Endicott Interconnect Technologies, has been named a Cambridge Who's Who Professional of the Year in Human Resources. While inclusion in the Cambridge Who's Who Registry is an honor, only a small selection of members in each discipline are chosen for this distinction. These special honorees are distinguished based on their professional accomplishments, academic achievements, leadership abilities, years of service, and the credentials they have provided in association with their Cambridge Who's Who membership.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
As the Director of Human Resources for Endicott Interconnect Technologies, Ms. Mastronardi manages and guides the overall functions of Human Resources services, policies, and programs. In addition, she manages the Compensation and Benefits functions by planning, developing, leading, and implementing new and revised compensation and benefit programs, policies and procedures in order to respond to the company's goals and competitive practices. Furthermore, she oversees the Human Resources Information Systems (HRIS), payroll and Corporate Education and Organizational Development. Ms. Mastronardi is a top female executive manager within the company, as well as an accomplished and respected professional in the field of human resources. She attributes her success to her adaptability as her mantra is "I truly want what you truly want...nothing different, and nothing more." She became involved in her profession because of her interest after an initial experience in benefits administration.
Ms. Mastronardi received a Master of Arts in applied science from Binghamton University in 1999. She is a member of SHRM. In the near future, Ms. Mastronardi hopes to develop exemplary company standards in human resources and pursue a part-time teaching position in human resources administration.
Endicott Interconnect Technologies is a manufacturing company that provides advanced electronic packaging solutions as well as printed circuit board fabrication, semiconductor packaging and assembly services. For more information about Endicott Interconnect Technologies, visit http://www.endicottinterconnect.com.
About Cambridge Who's Who
With over 400,000 members representing every major industry, Cambridge Who's Who is a powerful networking resource that enables professionals to outshine their competition, in part through effective branding and marketing. Cambridge Who's Who employs similar public relations techniques to those utilized by Fortune 500 companies and makes them cost-effective for members who seek to take advantage of its career enhancement and business advancement services. Cambridge is pleased to welcome its new Executive Director of Global Branding and Networking, Donald Trump Jr., who is eager to share his extensive experience in this arena with members.
Tuesday, February 7, 2012
Endicott Interconnect Technologies, Inc. Appoints Eltek as Sales Partner in Israel
ENDICOTT, NY—Endicott Interconnect Technologies, Inc. has extended its sales network with the appointment of Eltek (NASDAQ:ELTK) as its sales partner for Israel, thereby strengthening the company’s infrastructure and presence in the region. Under terms of the agreement, Eltek will generate opportunities to market Endicott Interconnect’s industry-leading, microelectronic packaging solutions.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
"I am delighted to announce this partnership with Eltek. Their position as the leading PCB company within Israel provides an ideal platform to introduce and integrate the core competencies of Endicott Interconnect’s microtechnology product range, with a special emphasis on system-in-package (SiP) solutions," stated Steve Payne, Director of European Sales & Marketing for EI. “I am confident that our new customers in the region will benefit from our differentiating solutions.”
Shay Shahar, Eltek's VP of Sales and Marketing commented: “This is an excellent opportunity for Eltek to diversify and expand its product range. Eltek is known as an innovative technologies provider. This partnership with EI, one of world's leaders in its area, will allow Eltek to more deeply penetrate the market and expose its customers to cutting edge solutions." Roberto Tulman, Eltek's CTO added: "This new SiP (System in Package) technology allows miniaturization of electronic systems while ensuring long-term high-reliability".
About Endicott Interconnect Technologies, Inc.
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, as well as systems integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.
About Eltek
Eltek is Israel's leading manufacturer of printed circuit boards, the core circuitry of most electronic devices. It specializes in the complex high-end of PCB manufacturing, i.e., HDI, multilayered and flex-rigid boards. Eltek's technologically advanced circuitry solutions are used in today's increasingly sophisticated and compact electronic products. For more information, please visit: www.eltekglobal.com.
Forward Looking Statement:
Certain matters discussed in this news release are forward-looking statements that involve a number of risks and uncertainties including, but not limited to statements regarding expected results in future quarters, risks in product and technology development and rapid technological change, product demand, the impact of competitive products and pricing, market acceptance, the sales cycle, changing economic conditions and other risk factors detailed in Eltek's Annual Report on Form 20-F and other filings with the United States Securities and Exchange Commission.
Monday, January 30, 2012
What's New About the EI Website?
EI has been in business for almost 10 years, has expanded into many new markets and has created products for hundreds of new customers. Unfortunately, our old website did not have the functionality or capability to adequately reflect these changes in our growing business. We decided to make significant improvements to our web presence in late 2011 when we partnered with Vibrant Creative to completely redesign and revamp our website. Below are the top 5 major areas of the website that we felt would create a more fluid and informative experience for our customers, suppliers and employees. The proceeding information will also act as a tool to help guide you, the visitor, through the new website to ensure that your time spent on the EI site is engaging as well as enjoyable.
New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.
Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.
Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.
Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.
Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.
New Look-The most obvious and apparent change to the website is the new look and feel. Aesthetic improvements include: updated color schemes, enhanced images, and bigger more robust, clickable icons. The most prominent and visually appealing enhancement to the EI website is the rotating pane, which outlines the markets EI competes in.
Less Click Throughs- A major criticism of the previous EI website was the fact that it took the visitor 3+ clicks to access important and relevant technical information. We decided to change that and made it easier for our customers and potential customers to access relevant information in 2 clicks or less. For instance, the visitor can access all of our white papers, certifications, news, products, markets, services, solutions, careers, and contact info within one click. And within 2 clicks the viewer can access our case studies, datasheets, brochures, articles, environmental policy, quality overview, partners, and community involvement.
Better Categorization of Information-EI is one of the most innovative companies in the world. We play in a variety of mission-critical markets, offer dozens of products and solutions, and perform many services. But from our old website you would never have known all that. To demonstrate EI’s leadership and provide the visitor with an easy way to locate information, we organized the site by markets, products, and services. To discover pertinent information about markets, product and services simply select one of these categories from the main navigation, which will give you access to information on our capabilities, technology, customers, expertise and applications.
Video Content- It’s one thing to read about our innovative technology but it’s a whole other thing to see it in action. To showcase our technology and applications we’ve incorporated videos throughout the new website. Please take a moment to view our newest corporate video, located on the homepage labeled “We Are EI”.
Social Media-Social Media isn’t just a fad anymore, it’s essential for every business. In order to disseminate information effectively, EI has initiated a social media campaign, utilizing Facebook, Twitter, Youtube, a blog, and internal/external eNewsletters. Follow us, like us and subscribe to us to stay connected and up-to-date on what’s going on at Endicott Interconnect.
Thursday, January 26, 2012
Endicott Interconnect Technologies, Inc. Announces the Launch of Their New Website
Over the past several months Endicott Interconnect has been working hand-in-hand with web developers, Vibrant Creative, to upgrade and revitalize their web presence.
The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.
To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.
The new website is a major upgrade over the previous EI site and contains more relevant information, better organization of content, easier access to critical information, and a stronger integration of visual and social media. “The new Endicott Interconnect website is a great marketing tool and will really help to showcase our technology and capabilities. We are very pleased with the results,” stated Jay McNamara, President and CEO of EI. Although the site has been live for several weeks, improvements and upgrades will continue to be made throughout the months of January and February.
To visit the new EI website visit www.endicottinterconnect.com. Please like us on Facebook at http://www.facebook.com/EndicottInterconnect and follow us on Twitter @EndicottInter.
Wednesday, January 18, 2012
Endicott Interconnect Technologies, Inc. Honors Employees at Eighth Annual Patent Award and Trade Secret Dinner
ENDICOTT, NY—Endicott Interconnect Technologies, Inc. (EI) honored 23 employees for patent applications filed, U.S. patents issued and trade secrets received in 2010 at an awards dinner and ceremony held Friday, January 13th 2012 at De Gennaro’s in Endicott, N.Y.
Awards were presented to: Dave Alcoe, Ash Bhatt, Kim Blackwell, Barry Bonitz, Benson Chan, Rabindra Das, Frank Egitto, Mike Hills, John Lauffer, How Lin, Roy Magnuson, Jay McNamara, Frank Marconi, Voya Markovich, Luis Matienzo, Tom Miller, Kostas Papathomas, Mark Poliks, Steve Rosser, Duane Stanke, Bob Testa, Bill Wilson, and Michael Wozniak.
“I am very proud of these individuals whose bold invention, creativity and technological innovation has contributed to the success of EI, ensuring our technical vitality and competitiveness in the open market. The hard work of those being honored tonight is a testament to the truly great things being developed by Endicott Interconnect,” commented James McNamara, President and CEO at EI.
Currently, Endicott Interconnect holds 129 U.S. patents and 32 Trade Secrets.
Monday, November 7, 2011
New High-Tech Center Creates One-of-a-Kind Electronic Systems Hub
In order to build upon Greater Binghamton's reputation as the premier hub of microelectronic technologies in New York State and utilize the vast existing local and statewide knowledge base, the Research Foundation of State University of New York, with support from Binghamton University and Endicott Interconnect Technologies. Inc., has launched a new collaboration that is expected to greatly accelerate the commercialization of new and improved electronics systems.
The corporation, known as the Binghamton Center for Emerging Technologies (BCET), will work in partnership with commercial, academic, and government agency members, through its New York Systems Integration and Packaging Consortium (NYSIP) to focus on small scale systems integration and packaging projects that could result in a broad range of new commercial and military products.
“Greater Binghamton has a long tradition of expertise in the electronics packaging field,” said Jay McNamara, president and CEO of Endicott Interconnect Technologies. “BCET not only adds to the region’s strengths in the industry but with our one-of-a-kind focus on small systems packaging, it will really put us on the map. Nothing like this exists anywhere else in the United States.”
Tapping into faculty expertise associated with Binghamton University’s Small Scale Systems Integration and Packaging Center (S3IP), the center is expected to serve as a core research facility for advanced technology.
“This initiative underscores the vital role that university-based research plays in driving our economy and will provide additional avenues to build meaningful collaborations with our researchers, “said Bahgat Sammakia, interim vice president of research at Binghamton University.
Launched as a way to meet the Department of Defense’s increasing need for fast turnaround in technology development, BCET will act as a conduit for high-tech federal contracts.
“Public and private partnerships like BCET are essential to translating university research into jobs,” said Congressman Maurice Hinchey (D-NY). “I am pleased that Binghamton University will be strengthening its partnerships with regional businesses like Endicott Interconnect to create and retain jobs related to the development of new commercial and military products. As a member of the House Defense Appropriations Committee, I am happy to have helped put these BCET partners in a position to fulfill technical needs of the Department of Defense and other federal agencies at an accelerated pace.”
Through the collaboration and joint expertise of its members, BCET will be able to develop innovative ideas and solutions much faster and more effectively. In addition, BCET will make it much easier to leverage local resources when it comes to attracting funding and contracts to the region.
“These tough economic times call for creative and collaborative thinking,” said Paul Wolfgramm, Sr., executive director of BCET. “And I believe BCET does exactly that. By joining together the region’s expertise and top-notch resources, the center will not only enhance research and technology transfer opportunities but will also strengthen business-to-business relationships making our region very attractive to outside investment. The result could mean more jobs for our region and make us a great place to start or relocate high-tech businesses.”
BCET membership is open to any organization within the technology area of microelectronics systems integration and packaging. Founding members, the Research Foundation of State University of New York and Endicott Interconnect Technologies, Inc., have already expanded BCET’s membership with the addition of BAE Systems, Inc. and Custom Electronics. Other industries in the region are currently being approached to join the group, which will add to BCET’s capabilities and resources. BCET will be funded strictly through membership dues but could charge fees depending on the nature of the contracts and agreements it is able to secure.
For more information on the organization’s policies and procedures, and application for membership, visit www.bcetny.com
Tuesday, October 25, 2011
Endicott Interconnect Technologies Announces 2011 Scholarship Award Recipients
Endicott Interconnect Technologies, Inc. (EI) announced the winners of the 2011 Scholarship Award Program at a breakfast ceremony held for the awardees and their parents on Wednesday, August 10th. Scholarships were awarded to: Erwing Augustin, son of Marie and Jean Augustin; Ryan Chan, son of On Chung and Benson Chan; Brian Hebbard, son of Denise and Terry Hebbard; Aaron Li, son of Dong and Handong Li; and Deanna Thompson, daughter of Pam and Tony Thompson.
College scholarships are awarded to five dependents of EI employees wishing to further their education. Winners of the $1,500 award were chosen from a very competitive field based upon their academic excellence, extracurricular activities, community service and personal essays. Submissions were evaluated by a panel of judges made up of EI employees.
“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
James J. McNamara Jr., President and CEO at EI, presented the awards to the winning students and their parents at the breakfast. “EI proudly sponsors this annual scholarship program in support of our employees and their families. These students demonstrate outstanding character and commitment to their community, as well as academic excellence and EI is delighted to be able to provide them with the means to help further their education. We would like to congratulate you on your accomplishments and wish you the best of luck in the coming academic year,” he commented.
College scholarships are awarded to five dependents of EI employees wishing to further their education. Winners of the $1,500 award were chosen from a very competitive field based upon their academic excellence, extracurricular activities, community service and personal essays. Submissions were evaluated by a panel of judges made up of EI employees.
“It is a pleasure to award these scholarships to students who have truly differentiated themselves through hard work both inside and outside the classroom. We at Endicott Interconnect congratulate you for your accomplishments and wish you continued success,” commented James J. McNamara, President and CEO at EI.
“EI is proud to continue our commitment to providing our associates and their families with opportunities to further their education,” commented James McNamara. “These students represent our future and we congratulate them on their achievements and wish them much success as they continue their academic pursuits.”
James J. McNamara Jr., President and CEO at EI, presented the awards to the winning students and their parents at the breakfast. “EI proudly sponsors this annual scholarship program in support of our employees and their families. These students demonstrate outstanding character and commitment to their community, as well as academic excellence and EI is delighted to be able to provide them with the means to help further their education. We would like to congratulate you on your accomplishments and wish you the best of luck in the coming academic year,” he commented.
Wednesday, July 20, 2011
Warren Dannelly Appointed to Vice President of Worldwide Sales
Warren Dannelly has been recently appointed to Vice President of Worldwide Sales. In his new position, Warren will be responsible for all of EI’s 12 direct sales force in the US and Europe, as well as the 6 US rep companies totaling 34 sales people and 7 European rep companies totaling 37 sales people. In addition, he has the field sales and operational responsibility for the EI / AVNET / IBM Secure Micro Solutions (SMS) business partnership, which today includes 33 regional offices for AVNET and 321 people.
Prior to EI, Warren was the Director of Sales for Texas Instruments Defense Systems which
was acquired by Raytheon Corporation and then Tyco Electronics Printed Circuit Group, as the Director of Sales for Aerospace and Defense.
Warren began his career as a Quality Engineer at Texas Instruments in 1979 and advanced to Quality Manager in 1983 before becoming promoted to the Director of Quality at NTI in 1996. Warren also worked for the Digital Equipment Corporation as Director of Quality and became Director of Business Development in 1991.
Warren served in the United States Air Force from 1973 to 1979. He graduated with a BS in Industrial Technology from Southern Illinois University, Carbondale, Illinois where he graduated with honors.
Prior to EI, Warren was the Director of Sales for Texas Instruments Defense Systems which
was acquired by Raytheon Corporation and then Tyco Electronics Printed Circuit Group, as the Director of Sales for Aerospace and Defense.
Warren began his career as a Quality Engineer at Texas Instruments in 1979 and advanced to Quality Manager in 1983 before becoming promoted to the Director of Quality at NTI in 1996. Warren also worked for the Digital Equipment Corporation as Director of Quality and became Director of Business Development in 1991.
Warren served in the United States Air Force from 1973 to 1979. He graduated with a BS in Industrial Technology from Southern Illinois University, Carbondale, Illinois where he graduated with honors.
Friday, June 24, 2011
Endicott Interconnect Receives More Than $100 Million in Defense Contracts
Endicott Interconnect Technologies announced it was awarded $101 million in Defense Department contracts in 2010 and this year to date.
EI said it was awarded development and production contracts totaling $89.4 million for the continued development of high-performance computing systems for the Defense Department throughout 2010.
This year, EI was awarded two hardware sustainment contracts, valued at $2.1 million and $9.5 million. The latter is a 10-year contract, the company said.
Since the initial contract awards in 2008 and 2009, EI has conducted research and development of system architecture and advanced, high-speed electronic packaging technologies, including building engineering hardware to support design verification and system capability enhancements. A production contract for this new system was made to EI at the end of 2010.
"This is a significant step forward in the next generation of high-performance computing and utilizes some of the most advanced electronic packaging solutions available in industry today," said Eric Hills, vice president -- business development/program office at EI. "EI had managed the program from the system's design and development phase through prototype and pre-production and is very excited to begin full production."
EI, based in Endicott, provides high-performance electronic packaging solutions for customers in the defense, aerospace, communications, computing, semiconductor, advanced test equipment and medical markets.
Wednesday, May 11, 2011
James J. McNamara Jr. Inducted into the Manufacturers Association of Central New York's Wall of Fame
James J. McNamara Jr. (Jay), President and CEO of Endicott Interconnect Technologies, Inc. will be honored for his lifetime achievements in manufacturing, by being inducted into the Manufacturers Association of Central New York (MACNY) Wall of Fame on May 12, 2011 at the Syracuse Oncenter.
Jay began his career as a Time Study Engineer at Burlington Industries in 1966. In 1972 he took a position with Amp Incorporated where Jay fine tuned his leadership abilities, enabling him to hold multiple executive positions with Amp and later Tyco Electronics. In 1995, Jay was appointed Vice President of Tyco Electronics assuming responsibility of 12 companies with Tyco located throughout 45 countries. Under Jay’s leadership and management, the wire and
cable business grew organically and via acquisition to $1.6 billion in annual sales.
In November 2002, Jay accepted the President/CEO position of newly formed Endicott Interconnect Technologies, Inc. Jay saw opportunity for growth
and expansion of the former IBM Microelectronics manufacturing site, through diversifying product offerings, advancing technology and expanding the customer base from a handful to over 130. EI has grown into an internationally renowned supplier of advanced electronic packaging solutions serving customers in the medical, defense/aerospace and high end computing markets.
The Manufacturers Association of Central New York (MACNY) advocates for the growth and development of New York’s manufacturing sector, a critical component of a vibrant New York economy. In total, the Manufacturers Association represents approximately 350 business and 55,000 workers across nineteen counties in Upstate New York.
Founded in 1913, MACNY is the largest associations of manufacturers in New York State and one of the oldest manufacturers associations in the nation. More information on MACNY can be found at www.macny.org.
Wednesday, April 20, 2011
Endicott Interconnect Technologies, Inc. names Michael J. Hills Chief Operating Officer
Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Michael J. Hills to the position of Chief Operating Officer (COO) reporting to James J. McNamara Jr., President and CEO. In his new position, Mike will be responsible for all manufacturing, engineering, supply chain, quality and facilities operations at the Endicott, NY location.
“As COO, Mike will focus his efforts on establishing new processes and controls to reduce operating expenses, maximizing manufacturing efficiencies and drive improvement to on-time delivery”, stated Mr. McNamara. “With his extensive background in both sales and operations, Mike is uniquely suited to translate the needs of the marketplace to operational excellence for continued growth and profitability of EI.”
Mike previously served as the Senior Vice President of Sales, Marketing and Product Management for EI. He has held a variety of senior executive positions since joining EI in December 2002 as Vice President of Business Development. Prior to EI, Mike worked for the IBM Corporation. He served in several key management positions including Superintendent of IBM Endicott Manufacturing Operations, and Manager of Engineering and Manufacturing Operations at the IBM Dublin, Ireland Server Group plant.
Mike holds a Bachelor of Science degree in Mechanical Engineering from Penn State University and a Masters in Business Administration from Cornell University S.C. Johnson Graduate School of Management.
Tuesday, December 16, 2008
Endicott Interconnect Technologies, Inc. Achieves AS9100 Aerospace Certification with 100% Score
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded certification to the AS9100 Quality Management Standard for aerospace suppliers. This certification signifies that its Endicott, N.Y. facility complies with all requirements of the AS9100 quality management system which covers quality assurance in design, development, production, installation and servicing, as well as purchasing, validation and shipping. The standard includes all ISO 9001:2000 requirements and is expanded to address needs specific to the international aerospace industry.
“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”
Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.
AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.
“Achieving AS9100 certification highlights EI’s commitment to our defense and aerospace customers to provide products and services that meet the highest industry standards in quality and reliability. We are particularly proud of the perfect score of 100% that we have achieved on our initial assessment,” stated K. Bradley Van Brunt, VP of Quality and Business Excellence at EI. “This certification also strengthens EI’s competitive position as a world-class supplier of innovative advanced packaging solutions to this industry.”
Bureau Veritas Certification (BVC), a widely recognized independent certification body, was chosen as EI’s partner in this process. BVC, who has registered over 55,000 clients around the world, stresses continuous improvement and is committed to adding value throughout the process. They were impressed with EI’s Business Excellence program, Management’s participation and the entire organization’s commitment to improvement. BVC noted that the multitude of awards from customers and industry, accompanied by increased company revenues and a rapidly expanding customer base, were evidence of the hard work and commitment EI employees put into improving customer satisfaction through innovative technology and quality business processes and assurance practices.
AS9100 meets requirements for government agencies such as the Federal Aviation Administration, U.S. Department of Defense, the International Aerospace Quality Group (IAQG) and the National Aeronautics and Space Administration as well as many multinational defense contractors. Information regarding EI’s assessment and status as a certified aerospace supplier is available at the IAQG website: http://www.sae.org.
Thursday, December 4, 2008
Department of Defense Awards Endicott Interconnect Technologies $12M Research & Development Contract
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
Friday, October 24, 2008
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award
The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Endicott Interconnect’s Mike Williams Receives the Paul A. Robert Award for Quality Principles, Practices and Values
ENDICOTT, NY — The American Society for Quality (ASQ), Binghamton Sector, has awarded Mike Williams, Quality Engineer at Endicott Interconnect Technologies, Inc. (EI) with the esteemed Paul A. Robert Award. This award is presented annually to the section's most deserving member for outstanding effort and dedication towards the advancement and recognition of quality principles, practices and values.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
Mr. Williams is the ASQ Binghamton Section’s expert in supplier quality and willingly interfaces with other section members seeking professional development and networking in several quality related areas. Daniel Sniezek, ASQ Regional Director presented the award to Mr. Williams at EI’s Business Excellence luncheon in September, 2008.
Brad Van Brunt, VP of Quality at EI, praised Mr. Williams’ commitment to improving quality standards. “Mike generously offers his time to assist, educate, and develop best practices in supplier quality for his community and peers. He is a valued member of our quality team.”
About the Award The Paul A. Robert Award was established in 1965 to honor Paul A. Robert, a founding member of the ASQ Binghamton Section who later became the National ASQ President. Mr. Robert was a driving force striving for the advancement and recognition of quality professionals at all levels.
About ASQ The American Society for Quality, founded after World War II, is the world’s leading authority on quality. With more than 100,000 individual and organizational members, this professional association advances learning, quality improvement, and knowledge exchange to improve business results, and to create better workplaces and communities worldwide. The ASQ Binghamton Section provides pertinent information to local area companies and qualified professionals to enhance job growth in the area of quality services and innovation. Section membership spans a wide range of industries and businesses including services, medical, manufacturing and consulting.
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