The CoreEZ™ semiconductor package developed by Endicott Interconnect Technologies utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core.
CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Applications
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.
For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc.
1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Saturday, April 7, 2007
Wednesday, April 4, 2007
Endicott Interconnect Technologies, Inc. Appoints Director of Engineering
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
Friday, March 23, 2007
Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M
ENDICOTT, NY -- The U.S. Department of Defense has awarded
Endicott Interconnect Technologies, Inc. multiple contracts totaling $164M to produce card frame assemblies including organic semiconductor packaging, module assemblies, printed circuit boards, full functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. EI also provided an innovative and cost effective logistics, shipping and storage solution to the DoD customer in support of this important endeavor.
EI initially recommended its HyperBGA® organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.
Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.
Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.
“Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business,” said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid,” he continued.
“It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs,” stated the DoD customer.
“The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer’s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements,” commented James J. McNamara, President and CEO at EI. “And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof.”
EI initially recommended its HyperBGA® organic substrate as an alternative to ceramic semiconductor packages because it enhances performance and reliability while offering a cost benefit. Early engineering expertise and development effort during the successful prototype phase of the program lead to the module assembly business as well and the initial $6.5M contract award.
Subsequent development and collaboration lead to additional technical scope for follow-on contracts. This included PCB fabrication, complex board assembly and higher level integration into card frame subsystems. One of the key enablers was the EI lead development and delivery of the testing required for this complex subsystem.
Contracts totaling $37.5M were awarded for certification of the product, which included build of the formal qualification parts and all related documentation, reporting, quality and reliability requirements. The remaining $120M contract was awarded for the first production order of fully integrated card frame assemblies to be delivered by year end.
“Our technical expertise and collaboration with the customer in the assembly and test of the modules and integrated card frame were key factors in winning this business,” said Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Rich engineering capability, manufacturing know-how and responsive execution lead to our successful bid,” he continued.
“It is becoming increasingly difficult for the government to find domestic sources with the technology, engineering and manufacturing prowess required to meet the demands of these government programs,” stated the DoD customer.
“The EI team deserves the credit for this key win. Our focused technical team and early involvement has positioned EI as an integral part of this customer’s supply chain strategy. We not only represent an innovative, on-shore supply source, but we have the ability to consistently manufacture technically challenging product. Additionally, we apply our engineering know-how to design-for-manufacturability improvements,” commented James J. McNamara, President and CEO at EI. “And of course, our vertically integrated product portfolio and business model positions us to supply laminate and PCB fabrication, module and board assembly, test and integration, along with a host of engineering services all under one roof.”
Tuesday, March 13, 2007
Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development
Endicott Interconnect Technologies, Inc. has announced the appointment of Rajinder Rai as Vice President, Research & Development reporting to Voya Markovich, effective immediately. He will assume responsibility for the management of resources and support functions for current and future R&D activities in response to business opportunities with state and federal program agencies.
Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.
Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.
“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”
Among the initial tasks facing Mr. Rai is assembling an innovative development team to implement advanced processes and install state-of-the-art manufacturing capabilities in order to meet customer requirements.
Raj holds a BS in Materials Science Engineering from the University of Notre Dame and an MS from Stevens Institute of Technology. He brings 12 years experience in the high-tech electronics industry with companies such as BAE Platform Solutions, IBM Microelectronics and IBM TJ Watson Research. He has held a variety of senior design and development engineering positions and possesses particular expertise in driving new business opportunities through his sound knowledge of electronic packaging, process development and new product introduction.
“I’m very pleased to welcome Raj back to our team,” commented Voya Markovich, Senior VP and Chief Technology Officer at EI. “His extensive experience in key development engineering roles utilizing advanced assembly techniques and processes, along with his business development and leadership skills ideally suits him to drive current and future R&D requirements.”
Thursday, February 22, 2007
Technology Neighbors Announce Process Development and Manufacturing Partnership for Medical Application Using World’s Finest Pitch Soldered Flip Chip
ENDICOTT, NY -- Endicott Interconnect Technologies, through their partnership with Unovis-Solutions, announced today that they have entered into a Manufacturing Services Agreement with a leading manufacturer of intravascular ultrasound (IVUS) catheters. Under terms of the Agreement, EI will develop and manufacture a state-of-the-art flexible substrate or circuit and assemble flip chip components to it per the manufacturer’s specifications. EI will procure materials and fixtures to be used in the flexible substrate fabrication and assembly process. The device manufacturer will be responsible for purchasing minimum quantities of the flexible circuit assembly over a 2-year period totaling $3.9 million.
This unique assembly is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. Assembled to this flexible substrate is a PZT (receiver/transmitter) and multiple flip chip die with 22 micron bumps on 70 micron pitch. These are some of the finest pitched, soldered interconnect flip chips in production anywhere in the world today. This distinctive assembly becomes part of an IVUS catheter device, which provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease.
“This opportunity came solely from our relationship with our innovative neighbors up the street, Unovis-Solutions,” stated James J. McNamara, President and CEO at EI. “Their Advanced Process Lab developed and automated critical manufacturing processes for this cutting edge, medical technology. Unovis-Solutions then recommended EI to the end customer for manufacture of the flip-chip assembly and provided us with complete process and equipment implementation guidelines to build the product in volume,” he continued.
EI in turn purchased a GSMxs flip chip placement system from Unovis-Solutions, because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. This advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.
“We recommended EI to partner with us in this endeavor because of their unique substrate development and manufacturing capabilities and their highly skilled teams’ ability to tackle manufacturing challenges that result in excellent quality, high performance solutions,” said George Westby, Director Advanced Process Laboratory at Unovis-Solutions. “EI and Universal Instruments Corporation, and now Unovis-Solutions, have collaborated on many programs. We utilize Universal’s GSM, Genesis™ and AdVantis™ platform systems in multiple lines throughout the plant and have served as a beta site facility for some of their products as well,” commented Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Unovis brings expertise in materials and assembly process development that provides innovative solutions needed to address our unique production demands. Together with Unovis as our partner, we will continue to solve some of the industry’s toughest process and assembly challenges.”
About Unovis-Solutions Unovis-Solutions enables its customers to succeed in the marketplace by partnering throughout all steps of the product life cycle. Customers benefit from Unovis' in-depth knowledge and expertise in electronics assembly, improving speed-to-market, scalability and competitiveness. Unovis offers a broad range of state-of-the-art manufacturing solutions including but not limited to component and die processing, odd form and final assembly, transport systems, flexible process cells and peripherals, and advanced process services and applied research. Established in July 2006 as a strategic merger of four divisions of Universal Instruments and Hover-Davis, Unovis effectively leverages the core competencies and the synergy between these companies. The firm draws on extensive systems integration experience and long-established relationships with third-party sub-system, equipment and process partners. Roland Heitmann, former General Manager of the Hover-Davis Direct Products Division leads the Unovis team.
This unique assembly is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. Assembled to this flexible substrate is a PZT (receiver/transmitter) and multiple flip chip die with 22 micron bumps on 70 micron pitch. These are some of the finest pitched, soldered interconnect flip chips in production anywhere in the world today. This distinctive assembly becomes part of an IVUS catheter device, which provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease.
“This opportunity came solely from our relationship with our innovative neighbors up the street, Unovis-Solutions,” stated James J. McNamara, President and CEO at EI. “Their Advanced Process Lab developed and automated critical manufacturing processes for this cutting edge, medical technology. Unovis-Solutions then recommended EI to the end customer for manufacture of the flip-chip assembly and provided us with complete process and equipment implementation guidelines to build the product in volume,” he continued.
EI in turn purchased a GSMxs flip chip placement system from Unovis-Solutions, because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. This advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.
“We recommended EI to partner with us in this endeavor because of their unique substrate development and manufacturing capabilities and their highly skilled teams’ ability to tackle manufacturing challenges that result in excellent quality, high performance solutions,” said George Westby, Director Advanced Process Laboratory at Unovis-Solutions. “EI and Universal Instruments Corporation, and now Unovis-Solutions, have collaborated on many programs. We utilize Universal’s GSM, Genesis™ and AdVantis™ platform systems in multiple lines throughout the plant and have served as a beta site facility for some of their products as well,” commented Wade Phelan, Vice President and General Manager of Complex Assembly Operations at EI. “Unovis brings expertise in materials and assembly process development that provides innovative solutions needed to address our unique production demands. Together with Unovis as our partner, we will continue to solve some of the industry’s toughest process and assembly challenges.”
About Unovis-Solutions Unovis-Solutions enables its customers to succeed in the marketplace by partnering throughout all steps of the product life cycle. Customers benefit from Unovis' in-depth knowledge and expertise in electronics assembly, improving speed-to-market, scalability and competitiveness. Unovis offers a broad range of state-of-the-art manufacturing solutions including but not limited to component and die processing, odd form and final assembly, transport systems, flexible process cells and peripherals, and advanced process services and applied research. Established in July 2006 as a strategic merger of four divisions of Universal Instruments and Hover-Davis, Unovis effectively leverages the core competencies and the synergy between these companies. The firm draws on extensive systems integration experience and long-established relationships with third-party sub-system, equipment and process partners. Roland Heitmann, former General Manager of the Hover-Davis Direct Products Division leads the Unovis team.
Wednesday, January 31, 2007
Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced a job fair scheduled for Saturday, February 3rd from 9am to 1pm at Huron Campus Reception in Endicott, NY. Professional, full-time manufacturing and supplemental manufacturing opportunities are available.
“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.
EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.
Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.
“These positions are needed to satisfy increased demand for our semiconductor packaging offerings used in high performance computing systems for blue chip customers, printed circuit board fabrication and assembly for some of the world’s largest EMS companies and also to support growth in the semiconductor and defense business segments,” commented James Sullivan, VP of Human Resources at EI.
EI’s strong finish in 2006 included a 6% increase in revenue over the previous year, the addition of 400 plus jobs, a $200M order backlog carried into 2007 and the renewal of long term supply agreements with key customers. The company spent $9.1M in 2006 for capital equipment to add the capacity necessary to meet growing customer demand and committed an additional $7M for this year. The firm has also been awarded 32 patents that influence the design, manufacture and handling of printed circuit boards and semiconductor packaging since its inception four years ago. Additionally, EI recently received facility security clearance from the U.S. Government required to manufacture product for military and defense contracts.
Huron Campus Reception is located on Heritage Circle, off North Street in Endicott, N.Y. Applications will be accepted and limited on-site interviews will occur. Refreshments will be available along with drawings for Binghamton Senators hockey tickets.
Wednesday, January 3, 2007
Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure
Endicott Interconnect Technologies, Inc. today announced that Warren Dannelly has been named Director of Sales, Global Accounts reporting to Michael Hills, effective immediately.
Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.
Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.
“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.
Warren is based in Louisville, Kentucky where he lives with his wife and two children.
Warren will collaborate with internal support teams to penetrate accounts targeted for future growth in the commercial, defense and aerospace market segments. He will also lend his expertise in sales management and relationship building to solidify existing accounts.
Mr. Dannelly’s military service background and BS in Engineering complement his 27 years experience in the electronic packaging industry with companies such as Amp-Akzo, Texas Instruments, Raytheon and Tyco Printed Circuit Group. He has held various business development, sales and quality management positions and is particularly skilled at developing strategic plans for penetrating Tier I and II military contractors, facilitating customer alliance agreements and risk mitigation analysis.
“As we continue to expand and diversify, we need a sales and support infrastructure that will strengthen our focus on existing customers while emphasizing future growth opportunities,” commented Michael Hills, Senior Vice President of Sales and Account Services at EI. “I believe Warren’s invaluable product, industry and business development knowledge puts him in the ideal position to help drive our growing business and strengthen our team,” he continued.
Warren is based in Louisville, Kentucky where he lives with his wife and two children.
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