Endicott Interconnect Technologies, Inc. (EI) announced today that they have conditionally qualified their assembly operation for high volume commercial applications located in China and are currently ramping for full production. The Company has leased 40,000 sq. ft. of production space from Lorom Industrial Co. in its Shenzhen facility and installed production equipment to support this operation.
EI will provide all materials, technical know-how and training, including work instructions, documentation and engineering support to ensure successful production start up. Lorom will be responsible for facility maintenance, production staff and general support per EI’s specifications and requirements. EI will maintain control of the design, new product introduction activity, specifications, quality requirements, sales and technical support worldwide for the products.
“I am looking forward to a mutually beneficial partnership with Lorom. Their world-class manufacturing facilities and skilled workforce along with their continual focus on achieving the highest quality products and value-added solutions at competitive prices will greatly benefit our customers worldwide,” commented James J. McNamara Jr., President and CEO of EI.
“This agreement complements EI’s long-term manufacturing strategy of delivering high quality, cost effective products to our global customer base. By expanding our assembly offering we are able to provide a total solution, including technical support from our Endicott facility during the new product introduction phase and cost effective, high volume production capability in China,” added Wade Phelan, VP and GM, Complex Assembly Division for EI.
“EI’s success is admirable. After many constructive meetings with mutual trust and respect, we applaud EI for choosing to partner with Lorom in this effort. This union makes our Lorom, Shenzhen plant more valuable than ever. This agreement also offers our employees the opportunity to work with one of the preeminent manufacturing companies while delivering our customers a broad range of high quality products at competitive prices. I strongly believe this partnership will strengthen our high-tech manufacturing development and bring prosperity through a substantial increase in global market share to both companies,” stated YT Yuan, President and CEO of Lorom Industrial Co., LTD.
About Lorom Industrial Co., LTD.
Lorom, established in 1988, is a vertically integrated, global provider for manufacturing and development of PCB assembly, bulk cables and assemblies, power and fiber patch cords, wire harnesses, adapters and terminators and value added solutions. Headquartered in Taipei, Taiwan, Lorom has a worldwide sales presence and state-of-the-art manufacturing capability in Taiwan and mainland China. For more information about Lorom, please visit www.lorom.com
Thursday, July 12, 2007
Thursday, June 7, 2007
Baker Announces Equipment Sales to Endicott Interconnect Technologies
M.E. Baker Company's MEI Division today announced the sale of multiple wet process tools to Endicott Interconnect Technologies' (EI). These innovative develop, etch, and strip tools are designed for processing flexible material in discrete and roll form. These tools will be used in the CAMM consortium enhancing set of the tools to have the new generation of R2R processing.
CAMM was established in 2005 when the United States Display Consortium (USDC) selected Binghamton University, EI and Cornell to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry, and academia to tackle the myriad challenges of this emergent technology. In addition to EI , Binghamton University and Cornell, members of CAMM include but are not limited to NASA and USDC, GE, Kodak, and Corning, and Arizona State Universities. Baker is a world leader in the design and manufacture of wet process equipment for a variety of industries including electronics, medical, automotive, defense & aerospace, and consumer products.
Baker's MEI Division offers fully integrated R2R solutions to the printed circuit board and microelectronics industries. With representation in Asia by WKK Distribution, Baker is uniquely positioned to bring R2R solutions from lab scale to high production manufacturing environment. More information can be found on CAMM's website at camm.binghamton.edu, EI's website at endicottinterconnect.com, or Baker's website at mebaker.com
CAMM was established in 2005 when the United States Display Consortium (USDC) selected Binghamton University, EI and Cornell to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry, and academia to tackle the myriad challenges of this emergent technology. In addition to EI , Binghamton University and Cornell, members of CAMM include but are not limited to NASA and USDC, GE, Kodak, and Corning, and Arizona State Universities. Baker is a world leader in the design and manufacture of wet process equipment for a variety of industries including electronics, medical, automotive, defense & aerospace, and consumer products.
Baker's MEI Division offers fully integrated R2R solutions to the printed circuit board and microelectronics industries. With representation in Asia by WKK Distribution, Baker is uniquely positioned to bring R2R solutions from lab scale to high production manufacturing environment. More information can be found on CAMM's website at camm.binghamton.edu, EI's website at endicottinterconnect.com, or Baker's website at mebaker.com
Tuesday, May 29, 2007
Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract
Endicott, NY― Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing. EI has successfully met the stringent DoD qualification requirements for its PCB, module and processing blade production.
This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.
Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.
“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”
“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”
This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.
Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.
“We’re committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well,” commented Rajinder Rai, Vice President of Research & Development at EI. “This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer.”
“Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy,” said Voya Markovich, Senior Vice President and CTO at EI. “We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry.”
Thursday, May 24, 2007
Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies
Billerica, MA – Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
EI is fabricating one of the most advanced and challenging applications in the North American market in terms of density and line width. With this latest purchase, including Paragon™-8000 and Paragon-9000 models, EI is the only PCB and semiconductor packaging fabricator in the Americas with six Orbotech LDI systems operating in a single location. This order also includes the purchase of two Discovery™ AOI systems.
“Our commitment to invest in leading-edge production tools helps us to advance our technology and ensure we can meet our increasing customer demand, particularly in military and defense applications. The use of Orbotech’s LDI and AOI technologies are essential elements in our strategy,” said Mr. James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “Specifically, the LDI systems eliminate the requirement for artwork and phototooling which improves quality, shortens cycle time and is a more cost effective manufacturing solution. For our HyperBGA® products, it enables the use of conventional resists versus expensive specialty materials with costly process maintenance. In the production of all of our complex applications, the yield improvement and registration accuracy resulting from Orbotech’s LDI is outstanding compared to traditional imaging methods. The addition of the Discovery AOI systems provides us with a faster, more cost-effective and technically superior method of inspecting circuit boards,” he added.
Mr. Barry Cohen, President of Orbotech, Inc., said: “We appreciate very much that EI has chosen our LDI and AOI solutions as an instrumental part of their advanced manufacturing capabilities. Their decision to now expand its use into ball grid array (BGA) production demonstrates the important benefits that our enabling technologies have for complex applications with very tight design requirements.”
Monday, May 21, 2007
HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated Thru-Holes for Increased Circuit Density
Endicott, NY -- Having to drill plated-thru-holes (PTHs) to make signal connections within printed circuit boards (PCBs) may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies (EI). New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
“Now, you only laser drill the length of the sub-composite, “said Voya Markovich, CTO and Senior Vice President of R&D. “You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board. We’re working to develop full HPC–Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products.”
HPC-Z provides a “PTH-like” connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced – instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other – whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
“You want to place as much circuitry as close together as possible,” said James Wilson, Product Manager – Printed Circuit Boards. “When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can’t get this dense a pitch with traditional PTH drilling.”
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Saturday, April 7, 2007
Thin Core Flip Chip Package Provides 199 Micron Via-to-Via Core Pitch
The CoreEZ™ semiconductor package developed by Endicott Interconnect Technologies utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core.
CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Applications
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.
About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.
For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
CoreEZ™ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages. The core via density provides 199 micron via-to-via core pitch, resulting in an essentially coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.
Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Applications
CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability, such as IP networking solutions. It is also well suited to aerospace applications requiring radiation tolerance. CoreEZ™ parts are available in any shape, combining the dense circuitry found in chip packaging with the configuration variety found in traditional PCB technology.
About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions. EI offers a unique mix of leading edge technology and technical know-how to provide customers with a real time-to-market advantage. An expert in first level semiconductor packaging assembly, EI combines advanced process and product development with extensive manufacturing capabilities to provide prototype to volume production of flip chip and wire bond packaging assemblies.
For more information on CoreEZ™, contact Endicott Interconnect Technologies, Inc. 1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
Wednesday, April 4, 2007
Endicott Interconnect Technologies, Inc. Appoints Director of Engineering
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. today announced that Robert Whitehouse has joined the Company as Director of Engineering reporting to James Fuller, effective immediately.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
Mr. Whitehouse will focus on optimizing manufacturing of products that leverage EI’s core competencies and will play a key role in building the Company’s engineering team to keep pace with overall company growth.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” commented James Fuller, Vice President and General Manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
Mr. Whitehouse’s military service background and BS from North Georgia College complement his 25 years experience in the printed circuit board and substrate fabrication industries. He has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corporation, Digital Equipment Corporation and Texas Instruments.
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