Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region. The award, which recognizes outstanding entrepreneurs who are building and leading dynamic, growing businesses, was presented at a gala event on June 27th held at the Carnegie Music Hall and Foyer in Pittsburgh, P.A.
McNamara joined the newly divested Endicott Interconnect as president and CEO in 2002. His entrepreneurial spirit and leadership led the former IBM Microelectronics operations to success through vertical integration supported by a significant vision for electronics packaging and solutions that include a strong influence on materials science. No one believed a new North American start-up company without a solid customer base would survive. Today, Endicott Interconnect continues to grow and thrive under McNamara’s watch.
“We heartily congratulate this year’s winners on their success,” said Kevin Pickels, Ernst & Young Entrepreneur Of The Year Program Director for Update New York, Western Pennsylvania and West Virginia. “This award recognizes all of the hard work, ingenuity and care these leaders have put into building and improving their businesses and communities. This group of winners is truly remarkable for all that they have accomplished.”
Award recipients were selected by an independent panel of judges of regional business, academic and community leaders. As a regional award winner, McNamara is eligible for consideration in the Ernst & Young Entrepreneur Of The Year 2008 national program, which will be announced on November 15, 2008.
About Ernst & Young’s Entrepreneur Of The Year
Ernst & Young’s Entrepreneur Of The Year is the world’s most prestigious business award for entrepreneurs. The award makes a difference through the unique way it encourages entrepreneurial activity among those with potential and recognizes the contribution of people who inspire others with their vision, leadership and achievement. As the first and only truly global award of its kind, Ernst & Young Entrepreneur Of The Year celebrates those who are building and leading successful, growing and dynamic businesses, recognizing them through regional, national and global awards programs in more than 135 cities in 50 countries.
About Ernst & Young
Ernst & Young, a global leader in professional services, is committed to enhancing the public’s trust in professional services firms and in the quality of financial reporting. Its 130,000 people in 140 countries pursue the highest levels of integrity, quality and professionalism in providing a range of sophisticated services centered on core competencies of auditing, accounting, tax and transactions.
Tuesday, July 1, 2008
Friday, June 27, 2008
ndicott Interconnect Technologies, Inc. Supports the Boy Scouts
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) donated $5,000.00 to the Baden-Powell Council, Boy Scouts of America, in support of an Aquatics Education structure to be built at Camp Tuscarora in Windsor, N.Y. The building will be the centerpiece of the waterfront at the camp and utilized for aquatics training including swimming, boating and fishing. The Baden-Powell Council serves communities in Broome, Chenango, Cortland, southern Seneca, Tioga and Tompkins Counties of New York and Susquehanna County of Pennsylvania.
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
“We are very pleased to support the Boy Scouts in their endeavors. Scouting positively impacts our community by offering values-based leadership training to our youth,” commented James McNamara, President and CEO at EI. “I applaud those employees, like Benson Chan, who supports his son in scouting and also volunteers his time to the organizational and fund raising needs of the Boy Scouts. The Company supports family value activities and encourages all of its employees to become involved in their community.”
Tuesday, June 17, 2008
Voya R. Markovich named an honored member in technology by Princeton Premier
New York, N.Y. -- Voya R. Markovich, senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., has been chosen for inclusion in the 2008-2009 Princeton Premier Registry.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Voya R. Markovich is the senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., a world class supplier of electronic interconnect solutions and electromechanical equipment. As a successor to IBM’s microelectronics division in Endicott, NY, Endicott Interconnect Technologies Inc. has more than four decades of experience in providing microelectronics solutions. As senior vice president and chief technical officer, Voya is responsible for overseeing the company’s day to day operations and managing its projects. He is a leading authority in the fields of electronic packaging and chemistry and is a member of the Chemical Society and IPC. Voya attended Polytech Institute of New York where he earned a Master of Arts degree in chemistry. He is equally accomplished in his personal pursuits, maintains an active agenda of community service and altruistic undertakings and enjoys attending church, nature walks, going to the theatre and being with family.
In acknowledgement of his exemplary career as senior vice president and chief technical officer of Endicott Interconnect Technologies, Inc., Voya R. Markovich is being included in the 2008/2009 Princeton Premier Registry where he will be listed among the most accomplished professionals of every industry from around the globe.
Tuesday, June 10, 2008
Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.
ENDICOTT, NY -- Congressman Michael Arcuri, representing New York’s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.
James McNamara discussed EI, emphasizing the Company’s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.
A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long range technology efforts,” commented James McNamara.
James McNamara discussed EI, emphasizing the Company’s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.
A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
“R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today’s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long range technology efforts,” commented James McNamara.
Wednesday, May 28, 2008
Endicott Interconnect Technologies Hosts IPC Technology Interchange Event
ENDICOTT, N.Y.― Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled “Will You Be Ready?: An Endicott Technology Interchange” on Wednesday, May 14th, 2008. The event took place at the Company’s headquarters in Endicott, N.Y. and included a tour of the facility, presentations from EI’s top technologists and a panel discussion featuring leading industry suppliers.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
“This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking,” stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI, as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry’s readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
“This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met,” commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Tuesday, May 6, 2008
Department of Defense Awards Endicott Interconnect Technologies $148.6M Contract Modification
ENDICOTT, N.Y.― The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA® organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application. This contract modification period of performance is May, 2008 to December, 2008.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
“This contract modification win is the result of our continued ability to meet the performance, quality and delivery demands of this program as well as key cost targets,” commented Eric Hills, Director of Military and Defense Programs at EI.
Thursday, May 1, 2008
Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction
Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.
With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.
“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”
Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.
Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.
“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”
Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.
Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.
Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.
Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
Endicott differentiates itself by offering superior technological solutions in a vertically integrated model with capabilities throughout the product life cycle including design, modeling and engineering support, manufacturing, testing, and logistics support services.
With its leading edge technology and product portfolio, Endicott supports various mission critical programs of its blue chip customers in the defense and aerospace, communications and computing infrastructure, semiconductor, advanced test equipment and medical markets.
“The company’s focus on the high-performance and complex technology segment of the market, and its ability to provide one-stop services with respect to complex PCBs has lead to significant growth over the last five years,” notes Frost & Sullivan Research Analyst Ashwin T. Ananthakrishnan. “It manufactures PCBs with an average layer count of 26 layers and boasts of multiple materials manufacturing capability, which includes non-hydroscopic materials and polyimides.”
Endicott’s vertically integrated model reduces the need for original equipment manufacturers (OEMs) to coordinate with numerous suppliers, minimizing potential delays in the supply chain, which often shortens customers’ time-to-market. This competitive advantage has led to a significant expansion of the company’s customer list, which includes many of the leading electronic OEMs.
Endicott also offers advanced lab services. Prior to delivering products to its clients, the company conducts several reliability tests to evaluate numerous factors such as the effects of temperature, humidity, shock and vibration. In addition, the company performs materials characterization and failure analysis testing to ensure that its products can withstand the most demanding and challenging environments.
“Endicott has met all relevant industry regulations and standards such as ISO, IPC, Military Specifications, RoHS compliance, and ITAR registration,” notes Ananthakrishnan. “In fact, its dedication to quality and reliability paid off when the company recently developed an award winning PCB design for IBM Zurich Research Laboratory comprising 36 layers, 36053 blind vias, and 29246 connections measuring 1.6 miles in length.”
Endicott continuously monitors and evaluates client satisfaction, technical support, pricing and other key parameters in an effort to increase brand recognition. Starting off with a handful of customers, the company now has a growing list of satisfied customers in a variety of high-end markets.
Currently, Endicott has a market share of 3.3 percent in the highly competitive North American PCB market, which generated revenues of $4.8 billion in 2007 and is projected to touch $5.1 billion by 2010.
Endicott’s experience in the development and manufacturing of electronics packaging solutions using leading edge technology along with its reputation for outstanding quality and technological innovation have contributed to its success in the highly competitive PCB market.
In recognition of these achievements, Frost & Sullivan is proud to present Endicott with the 2008 North American Award for Growth Excellence in the PCB market. Each year, Frost & Sullivan presents this Award to the company that has demonstrated excellence in implementing and sustaining growth within shipments, revenues, and profitability.
Frost & Sullivan Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry.
Subscribe to:
Posts (Atom)