Endicott Interconnect Technologies, Inc., will use the IPC Printed Circuits Expo, APEX and the Designers Summit to showcase its printed circuit board fabrication, advanced electronic semiconductor packaging and 2nd level packaging solutions.
Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.
EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.
EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.
IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.
Tuesday, January 3, 2006
Saturday, December 24, 2005
Endicott Interconnect Announces Role in Center for Advanced Microelectronics Manufacturing
The United States Display Consortium (USDC) announced today that it had awarded a contract for the creation of a Center for Advanced Microelectronics Manufacturing (CAMM) to a team consisting of Binghamton University, Cornell University and Endicott Interconnect Technologies.
The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center. The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center. The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.
Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."
The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center. The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center. The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.
Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."
Thursday, June 17, 2004
Endicott Interconnect Technologies Announces $10 Million Capital Expansion
Endicott Interconnect Technologies today announced a $10 Million capital expansion program to meet robust demand in all of its products. "Endicott Interconnect's printed circuit board, semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," says Jim Herard, Marketing Manager for Endicott Interconnect.
The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
"I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.
The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
"I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.
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