ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. recently celebrated the issuance of its 27th U.S. Patent since becoming an independent company just four years ago. EI, which ranks 13th among the top U.S. PCB companies in revenues (Printed Circuit Design & Manufacture, September, 2006), is led by only three of those companies in PCB related issued patents. The firm’s impressive patent portfolio covers innovative substrate designs and manufacturing processes and is strong evidence of EI’s technical expertise in this very competitive area. Already, EI owns more issued U.S. Patents relating to PCB’s than many of its main competitors.
EI’s expertise in electronic packaging substrates stems from the know-how of innovative technologists. The company’s heritage has provided a long history of technological advancements that continues today with EI’s top 11 patent holders accounting for over 700 patents combined. They include; Voya Markovich (171), Kostas Papathomas (154), John Lauffer (83), Robert Japp (59), Frank Egitto (55), Luis Matienzo (49), James Wilson (40), Thomas Miller (33), Benson Chan (32), John Kresge (32) and Mark Poliks (32).
“EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. This technical leadership has been accomplished through the creativity and invention of our talented personnel,” commented James J. McNamara, President and CEO at EI. “This innovation is a key to EI’s success in the advanced packaging arena and clearly differentiates us from our competitors,” he continued.
Technical leadership is further exemplified by EI technologists through collaboration with universities, consortia and leadership roles within industry organizations. How Lin serves as an Adjunct Professor at Binghamton University and Jeff Knight is the Advanced Packaging Committee Chair for the Electronic Components and Technology Conference (ECTC).
Voya Markovich is Chair of the Interconnect Section for the Electronic Components and Technology Conference (ECTC), President of the International Microelectronics and Packaging Society (IMAPS) New Jersey Chapter, and a member of the industrial and executive boards for the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM) and the Watson School of Engineering and Applied Science at Binghamton University.
Mark Poliks is the Electronic Components and Technology Conference (ECTC) Materials/Processing Section Co-Chair, a Research Professor at Binghamton University, Northeast Regional Program Chair for the American Chemical Society, Advisory Board Member of the Integrated Electronics Engineering Center (IEEC) and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM).
Additionally, EI technologists including Benson Chan, Frank Egitto, Mark Poliks, Roy Magnuson, Mike Rowlands, Luis Matienzo, How Lin and Vara Calmidi recently taught a course in Flexible Electronics at Cornell University.
Tuesday, November 28, 2006
Thursday, October 12, 2006
EI's Markovich Receives the Northeast Regional Industrial Innovation Award
ENDICOTT, NY -- Voya R. Markovich was selected by the American Chemical Society (ACS) to receive this year's Northeast Regional Industrial Innovation Award. The awards ceremony, held in conjunction with the 34th Northeast Regional Meeting of the ACS, took place on Friday, October 6th at the Holiday Inn Arena in Binghamton, New York.
This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems. Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.
"Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors," commented James J. McNamara, President and CEO at EI. "We are proud of Voya's accomplishments and thank him for his many innovations that have contributed to EI's success," he continued.
This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems. Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.
"Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors," commented James J. McNamara, President and CEO at EI. "We are proud of Voya's accomplishments and thank him for his many innovations that have contributed to EI's success," he continued.
Tuesday, January 3, 2006
EI at IPC Printed Circuits Expo, APEX and the Designers Summit 2006
Endicott Interconnect Technologies, Inc., will use the IPC Printed Circuits Expo, APEX and the Designers Summit to showcase its printed circuit board fabrication, advanced electronic semiconductor packaging and 2nd level packaging solutions.
Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.
EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.
EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.
IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.
Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.
EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.
EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.
IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.
Saturday, December 24, 2005
Endicott Interconnect Announces Role in Center for Advanced Microelectronics Manufacturing
The United States Display Consortium (USDC) announced today that it had awarded a contract for the creation of a Center for Advanced Microelectronics Manufacturing (CAMM) to a team consisting of Binghamton University, Cornell University and Endicott Interconnect Technologies.
The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center. The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center. The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.
Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."
The Center for Advanced Microelectronics Manufacturing will be located in the Endicott Interconnect Facility and initially staffed by a team of researchers from EI, Binghamton University and Cornell University. Baghat Samakia, of Binghamton University will lead the center. The Center expects to draw upon the members and interests of the IEEC and the Universities High Tech Commercialization Center. The objective of the research to be performed is to explore technologies and manufacturing practices for low cost, high performance flexible microcircuits for such applications as flexible displays, lighting panels and advanced microelectronics. As part of the activity, the USDC will provide key manufacturing tools to be used in the research. The activity will draw upon the past experience of members of the EI team in roll-to-roll processing of flexible substrates.
Jay McNamara, CEO of Endicott Interconnect Technologies said "Endicott Interconnect is very proud to be part of the new United States Display Consortium's Center for Advanced Microelectronics Manufacturing that will be located here at our Endicott, New York facility. We are also very pleased to demonstrate our strong partnerships with both Binghamton University and Cornell University. The research at this facility will focus on technology elements required to produce low-cost, high function electronic systems, on user-friendly flexible substrates that will be the backbone of tomorrow's electronics. Efforts like this continue to show the technology leadership and business opportunities available in New York State."
Thursday, June 17, 2004
Endicott Interconnect Technologies Announces $10 Million Capital Expansion
Endicott Interconnect Technologies today announced a $10 Million capital expansion program to meet robust demand in all of its products. "Endicott Interconnect's printed circuit board, semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," says Jim Herard, Marketing Manager for Endicott Interconnect.
The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
"I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.
The capital package includes monies for equipment to produce large printed circuit boards greater than 28 inches long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included. "We are very excited about the strong demand for our products, especially in the defense and aerospace markets, where our reliability provides our customers with a real advantage over competitive products," indicated Jim Fuller, Vice President of Business Development for Endicott Interconnect. Much of the funding will be spent on equipment which will enter production during the second half of this year.
Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year, and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.
"I'm very excited to announce such a comprehensive package of expansion in all of our lines of business. We continue to gain market share in all aspects of our business and are committed to meet our customers' needs into the future. This package is part of our ongoing efforts to be the premier supplier of electronic packaging solutions in the world." said Jay McNamara, CEO of Endicott Interconnect Technologies.
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