PORTLAND, Ore.-- Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class production laser systems for microengineering applications, today announced that Endicott Interconnect Technologies, Inc. (EI) -- a leading New York-based interconnect supplier -- has placed a follow-on, multiple-system order for ESI's ultraviolet (UV) laser drilling systems. A longtime ESI customer, EI will utilize ESI's single-head and dual-head systems to optimize volume manufacturing of its high-performance application-specific integrated circuits (ASICs).
"ESI's UV laser drilling systems deliver enhanced reliability and throughput for our high-volume manufacturing requirements, providing a competitive advantage that we can pass onto our customers," said Mr. Jim Fuller, VP and GM, Semiconductor Packaging of EI. "As a result, ESI is our preferred provider for this essential technology. We have experienced excellent performance from our existing ESI UV laser tools, and are confident these new systems will continue to raise the bar on speed and accuracy."
"The follow-on, multi-system order demonstrates EI's commitment to ESI, and further solidifies our position as the industry's premier supplier of UV laser drilling tools that can meet customers' most aggressive technology requirements," noted Sidney Wong, senior director of product market solutions at ESI. "We look forward to extending our long-term relationship with EI as we continue developing new solutions that enable our global customers to meet their advanced product and technology roadmaps."
ESI's high-repetition UV laser drilling systems perform high-quality, high-volume drilling of blind microvias in advanced IC packages, such as flexible circuits and high-density interconnect (HDI). Key demand drivers of ESI's interconnect products include its ultra-high speed digital beam positioning module and its enhanced pulse rate for via formation. The single-head shaped beam produces more than 25,000 high-quality microvias per minute on advanced IC packages. By contrast, the dual-head shaped beam system can produce more than 60,000 vias per minute in multi-layer laminated materials up to 533 mm x 635 mm.
About ESI, Inc.
ESI is a pioneer and leading supplier of world-class production laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors -- semiconductors, components and electronic interconnect -- by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.
Tuesday, December 19, 2006
Tuesday, November 28, 2006
Technological Leadership Continues to Differentiate Endicott Interconnect
ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. recently celebrated the issuance of its 27th U.S. Patent since becoming an independent company just four years ago. EI, which ranks 13th among the top U.S. PCB companies in revenues (Printed Circuit Design & Manufacture, September, 2006), is led by only three of those companies in PCB related issued patents. The firm’s impressive patent portfolio covers innovative substrate designs and manufacturing processes and is strong evidence of EI’s technical expertise in this very competitive area. Already, EI owns more issued U.S. Patents relating to PCB’s than many of its main competitors.
EI’s expertise in electronic packaging substrates stems from the know-how of innovative technologists. The company’s heritage has provided a long history of technological advancements that continues today with EI’s top 11 patent holders accounting for over 700 patents combined. They include; Voya Markovich (171), Kostas Papathomas (154), John Lauffer (83), Robert Japp (59), Frank Egitto (55), Luis Matienzo (49), James Wilson (40), Thomas Miller (33), Benson Chan (32), John Kresge (32) and Mark Poliks (32).
“EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. This technical leadership has been accomplished through the creativity and invention of our talented personnel,” commented James J. McNamara, President and CEO at EI. “This innovation is a key to EI’s success in the advanced packaging arena and clearly differentiates us from our competitors,” he continued.
Technical leadership is further exemplified by EI technologists through collaboration with universities, consortia and leadership roles within industry organizations. How Lin serves as an Adjunct Professor at Binghamton University and Jeff Knight is the Advanced Packaging Committee Chair for the Electronic Components and Technology Conference (ECTC).
Voya Markovich is Chair of the Interconnect Section for the Electronic Components and Technology Conference (ECTC), President of the International Microelectronics and Packaging Society (IMAPS) New Jersey Chapter, and a member of the industrial and executive boards for the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM) and the Watson School of Engineering and Applied Science at Binghamton University.
Mark Poliks is the Electronic Components and Technology Conference (ECTC) Materials/Processing Section Co-Chair, a Research Professor at Binghamton University, Northeast Regional Program Chair for the American Chemical Society, Advisory Board Member of the Integrated Electronics Engineering Center (IEEC) and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM).
Additionally, EI technologists including Benson Chan, Frank Egitto, Mark Poliks, Roy Magnuson, Mike Rowlands, Luis Matienzo, How Lin and Vara Calmidi recently taught a course in Flexible Electronics at Cornell University.
EI’s expertise in electronic packaging substrates stems from the know-how of innovative technologists. The company’s heritage has provided a long history of technological advancements that continues today with EI’s top 11 patent holders accounting for over 700 patents combined. They include; Voya Markovich (171), Kostas Papathomas (154), John Lauffer (83), Robert Japp (59), Frank Egitto (55), Luis Matienzo (49), James Wilson (40), Thomas Miller (33), Benson Chan (32), John Kresge (32) and Mark Poliks (32).
“EI is committed to developing new processes, technologies and techniques that enable progress in the electronics industry. This technical leadership has been accomplished through the creativity and invention of our talented personnel,” commented James J. McNamara, President and CEO at EI. “This innovation is a key to EI’s success in the advanced packaging arena and clearly differentiates us from our competitors,” he continued.
Technical leadership is further exemplified by EI technologists through collaboration with universities, consortia and leadership roles within industry organizations. How Lin serves as an Adjunct Professor at Binghamton University and Jeff Knight is the Advanced Packaging Committee Chair for the Electronic Components and Technology Conference (ECTC).
Voya Markovich is Chair of the Interconnect Section for the Electronic Components and Technology Conference (ECTC), President of the International Microelectronics and Packaging Society (IMAPS) New Jersey Chapter, and a member of the industrial and executive boards for the Integrated Electronics Engineering Center (IEEC), the Center for Advanced Microelectronics Manufacturing (CAMM) and the Watson School of Engineering and Applied Science at Binghamton University.
Mark Poliks is the Electronic Components and Technology Conference (ECTC) Materials/Processing Section Co-Chair, a Research Professor at Binghamton University, Northeast Regional Program Chair for the American Chemical Society, Advisory Board Member of the Integrated Electronics Engineering Center (IEEC) and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM).
Additionally, EI technologists including Benson Chan, Frank Egitto, Mark Poliks, Roy Magnuson, Mike Rowlands, Luis Matienzo, How Lin and Vara Calmidi recently taught a course in Flexible Electronics at Cornell University.
Thursday, October 12, 2006
EI's Markovich Receives the Northeast Regional Industrial Innovation Award
ENDICOTT, NY -- Voya R. Markovich was selected by the American Chemical Society (ACS) to receive this year's Northeast Regional Industrial Innovation Award. The awards ceremony, held in conjunction with the 34th Northeast Regional Meeting of the ACS, took place on Friday, October 6th at the Holiday Inn Arena in Binghamton, New York.
This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems. Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.
"Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors," commented James J. McNamara, President and CEO at EI. "We are proud of Voya's accomplishments and thank him for his many innovations that have contributed to EI's success," he continued.
This acknowledgment is awarded to individuals and teams whose creative innovations have contributed to the commercial success of their company and, consequently, to the good of the community. Mr. Markovich was honored for his part in the development of advanced electronic packaging and interconnect systems. Markovich is Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. He was previously a Senior Technical Staff Member and Senior Manager of the world-wide materials, processes and assembly development group for organic laminate products at IBM Corporation. Markovich holds over 170 US patents and continues to lead the industry in the development of new processes and materials for integrated active and passive components, optical and radio frequency (RF) design for advanced systems and integrated electronic packaging. Mr. Markovich earned his M.S. in Chemistry from Polytechnic Institute of New York in 1980.
"Voya is recognized as a leading innovator in the global advanced electronics packaging and interconnect industry. His inventions and the technology manufactured by their practice form the interconnection basis for all leading information technology and telecommunication systems. He and his team at EI are leading the way to create smaller and more discrete interconnect structures for ultra high performance systems for the information technology, medical, aerospace and defense sectors," commented James J. McNamara, President and CEO at EI. "We are proud of Voya's accomplishments and thank him for his many innovations that have contributed to EI's success," he continued.
Tuesday, January 3, 2006
EI at IPC Printed Circuits Expo, APEX and the Designers Summit 2006
Endicott Interconnect Technologies, Inc., will use the IPC Printed Circuits Expo, APEX and the Designers Summit to showcase its printed circuit board fabrication, advanced electronic semiconductor packaging and 2nd level packaging solutions.
Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.
EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.
EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.
IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.
Established quality practices and a keen understanding of manufacturing processes gained through continuous advancements in technology deliver consistent and predictable product quality in printed circuit board fabrication. EI's offering includes 40+ layer counts, complex backplanes, various via configurations and multiple resin systems. In addition, EI meets ISO, IPC and military specifications, RoHS compliance, ITAR registration and is compatible with lead-free assembly processes.
EI delivers competitive and technical differentiation to customers by providing engineering expertise in advanced processes, product development and manufacturing supporting 1st and 2nd level packaging and assembly solutions. Process capabilities for 1st level packaging using flip chip, wire bond and system-in-package assembly techniques include component placement and related assemblies as well as underfilling, glob top, overmold, coverplate and BGA attach, part marking and test. 2nd level packaging capabilities include prototype development, reliable and flexible manufacturing, in-circuit test development and support, as well as functional and systems test and field service/life cycle management.
EI will also showcase organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications. Semiconductor packaging offerings include HyperBGA, Hyper ZEI, Core EASEI and Wire Bond PBGA.
IPC Printed Circuits Expo, APEX and the Designers Summit takes place at the Anaheim Convention Center, Anaheim, CA, February 8-10, 2006.
Subscribe to:
Posts (Atom)