ENDICOTT, NY -- Endicott Interconnect Technologies, Inc. (EI) today announced that it has been awarded a $12M research & development contract by the U.S. Department of Defense to continue development of electronic packaging technologies including printed circuit boards and organic substrates for a super computer application.
This contract supports the exploration and development of advanced high speed electronic packaging technologies; specifically, system development, printed circuit board and substrate design along with the evaluation of alternative material sets.
Existing facilities have been expanded and modified to accommodate new equipment which has been purchased to support this work and EI anticipates additional hiring needs.
The work for the DoD we are doing here in Endicott needs to be performed within the boundaries of the U.S, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel necessary to produce these future technologies," commented Rajinder Rai, VP of R&D and GM of Integrated Circuit Assembly Services at EI.
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